Substrate Holder Structure for Uniform Chip Bonding Pressure
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Solution Overview
Problem
Existing bonding technologies face challenges in stably bonding semiconductor chips of similar size to individual substrates due to insufficient application of heat and pressing load, especially when the convex parts of the stage are smaller than the substrate, leading to unstable bonding.
Innovation Solution
A substrate holder with a base and positioning member that securely holds individual substrates on its upper surface, allowing for uniform suction and fixation through through holes, ensuring even application of heat and pressure across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the convex part of the stage is made smaller than the individual substrate to avoid interference with the palette, then the palette can be properly positioned, but the heat and pressing load cannot be sufficiently applied to the semiconductor chip and substrate
Solution Approach 1:
The patent introduces a base as an intermediary component between the stage and the individual substrate. The base has a larger area than the convex part of the stage, allowing it to receive sufficient heat and pressing load from the stage while simultaneously supporting the entire individual substrate. This intermediary structure resolves the contradiction by decoupling the stage size constraints from the substrate support requirements.
2Ease of operation
If the convex part of the stage is made smaller than the individual substrate, then the palette interference is avoided, but the peripheral part of the substrate extending outward from the convex part is not supported
Solution Approach 1:
The base serves as a mediator that extends the support area beyond the convex part of the stage. It has a larger surface area that can accommodate the entire individual substrate, including peripheral regions that would otherwise be unsupported. This allows the substrate to be stably supported while the stage convex part remains small for palette compatibility.
3Reliability
If a substrate holder with a base is introduced to support the entire substrate, then uniform heat and pressure application is achieved, but the device complexity increases
Solution Approach 1:
The base is designed to perform multiple functions simultaneously: it supports the entire individual substrate, receives heat from the stage, transmits pressing load, and provides a stable platform for bonding. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable bonding of semiconductor chips to individual substrates of similar size by ensuring uniform heat and pressure application, even when the substrate size matches the stage, thereby improving bonding stability and reducing processing complexity and costs.
Implementation Method 1
a lower surface of the base is sucked and fixed to a placement surface of a stage of a bonding apparatus
Data Source
AI summary
A bonding system (90) is provided with a bonding device (80) for bonding semiconductor chips (45) to individual substrates (41), and a substrate holder (10) for holding the individual substrates (41), the bonding device (80) being provided with a stage (31) for fixing, by suction, the substrate holder (10) on a placement surface (13a), the substrate holder (10) being provided with a plate-shaped base (11) and a positioning member (21) that is provided on the base (11) and that defines the position of the individual substrates (41), the base (11) having an upper surface (11a) on which the individual substrates (41) are placed and a lower surface (11b) that is fixed by suction onto the placement surface (31a).