Substrate Holder Center Teaching for Accurate Wafer Transfer
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Solution Overview
Problem
In substrate processing for semiconductor manufacturing, there is a risk of positional deviation when reinstalling the substrate holder (boat) in a vertical substrate processing apparatus, which can lead to misalignment and potential damage during wafer transfer.
Innovation Solution
A technique is employed to calculate the positional deviation of the substrate holder's center using a photoelectric sensor with an optical path set within its rotation radius, allowing for accurate detection and correction of the center position through a teaching process involving R-axis and Z-axis scans to determine the deviation amount and angle, thereby updating the wafer transfer position information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the substrate holder is removed for maintenance and reinstalled, then maintenance work can be performed, but positional deviation occurs leading to misalignment
Solution Approach 1:
The patent applies preliminary action by performing a teaching process before normal operation to detect and correct positional deviation. The center detection unit measures the actual center position of the substrate holder before wafer transfer operations begin, and the teaching unit stores this information to correct subsequent transfer positions, preventing misalignment issues that would otherwise occur after maintenance reinstallation
Solution Approach 2:
The patent implements feedback through the center detection unit that continuously monitors the substrate holder's center position and provides this information to the teaching unit. This feedback mechanism allows the system to automatically adjust transfer positions based on actual measured deviations, ensuring consistent alignment accuracy regardless of maintenance-induced positional changes
2Manufacturing precision
If manual alignment methods are used for substrate holder reinstallation, then positional deviation can be corrected, but time consumption and labor increase
Solution Approach 1:
The patent replaces manual mechanical alignment methods with an automated optical detection system. The center detection unit uses optical sensors to automatically measure the substrate holder's center position, and the teaching unit automatically processes this data to correct transfer positions, eliminating the need for time-consuming manual alignment operations while maintaining high precision
Solution Approach 2:
The system performs self-alignment through the automated teaching process. The substrate holder's actual center position is automatically detected and used to correct transfer positions without requiring external manual intervention. The system serves itself by automatically compensating for positional deviations that occur during maintenance, significantly reducing alignment time and labor requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures precise alignment of the substrate holder, reducing the risk of misalignment and enhancing the reliability and efficiency of wafer transfer processes in substrate processing apparatuses.
Implementation Method 1
acquiring a detection result of a photoelectric sensor with an optical path set within a rotation radius of a substrate holder while rotating the substrate holder
Data Source
AI summary
There is provided a technique that includes: a controller configured to be capable of acquiring a detection result of a photoelectric sensor with an optical path set within a rotation radius of a substrate holder while rotating the substrate holder, and calculating a deviation of a center of the substrate holder based on an angle or a timing at which the optical path is blocked by the substrate holder.