Substrate Holder Cleaning Jig for Wafer Grip and Fast Drying
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Solution Overview
Problem
Existing substrate processing apparatuses face inefficiencies in cleaning the heating unit after plating processing, leading to potential contamination and reduced holding force for wafers due to rinse liquid adherence.
Innovation Solution
A substrate processing apparatus with a cleaning jig featuring holes, wall members, and blade members that facilitate efficient rinsing and drying of the heating unit by diffusing rinse liquid through the substrate holder, minimizing liquid adherence and maintaining wafer holding force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate holder rotates at high speed to improve cleaning efficiency, then cleaning productivity increases, but the substrate holder's grip on wafers weakens due to centrifugal force
Solution Approach 1:
The substrate holder is divided into multiple independent holding positions arranged radially, allowing different regions to serve different functions. The outer peripheral portion is optimized for high-speed rotation during cleaning, while the central portion maintains wafer holding capability, resolving the conflict between cleaning efficiency and holding force.
Solution Approach 2:
The substrate holder is designed to rotate at different speeds for different operations: high rotation speed during cleaning to improve productivity, and low or zero rotation speed during wafer loading/unloading to maintain holding force. The system dynamically adjusts rotation speed based on operational requirements.
2Manufacturing precision
If rinse liquid is supplied abundantly to clean the heating unit, then cleaning quality improves, but liquid adherence to wafers increases causing contamination
Solution Approach 1:
The heating unit cleaning function is localized to specific regions of the substrate holder, with rinse liquid supplied only to the heating unit area rather than the entire substrate holder. This localized cleaning approach improves cleaning quality while preventing liquid from reaching and adhering to wafers held in other regions.
Solution Approach 2:
The substrate holder acts as an intermediary structure that separates the cleaning zone from the wafer holding zone. By design, it allows rinse liquid to clean the heating unit while preventing the liquid from contacting wafers, thus mediating between the need for thorough cleaning and the need to avoid liquid adherence.
3Manufacturing precision
If the cleaning process is extended to ensure thorough heating unit cleaning, then cleaning completeness improves, but processing time increases
Solution Approach 1:
The substrate holder rotates continuously during the cleaning process, ensuring that all surfaces of the heating unit are continuously exposed to rinse liquid. This continuous rotational motion achieves thorough cleaning completeness without requiring extended processing time, as the rotation efficiently distributes cleaning liquid across all surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively cleans the heating unit while preserving the substrate holder's grip on wafers, ensuring efficient plating processing and rapid chamber drying.
Implementation Method 1
A cleaning liquid supply is provided to supply the cleaning liquid toward the bottom surface of the cleaning jig held by the substrate holder. The cleaning jig is provided with at least one hole through which the cleaning liquid discharged from the cleaning liquid supply passes toward the cover body.
Implementation Method 2
The rotational driving unit is configured to rotate the substrate holder. The controller is configured to control the rotational driving unit to rotate the substrate holder.
Data Source
AI summary
A substrate processing apparatus includes a substrate holder, a rotational driving unit, a cover body, a transfer mechanism, a cleaning liquid supply and a controller. The substrate holder is configured to hold a substrate. The rotational driving unit is configured to rotate the substrate holder. The cover body is configured to cover a top surface of the substrate held by the substrate holder. The transfer mechanism is configured to transfer a cleaning jig to the substrate holder. The cleaning liquid supply is configured to supply a cleaning liquid toward a bottom surface of the cleaning jig held by the substrate holder. The controller is configured to control the rotational driving unit to rotate the substrate holder. The cleaning jig is provided with at least one hole through which the cleaning liquid discharged from the cleaning liquid supply passes toward the cover body.