Substrate Holder Contact Shifting for Contaminant Removal
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Solution Overview
Problem
Existing substrate processing apparatuses face inefficiencies in contaminant removal from substrate holders and lifting pins, requiring frequent substrate changes and maintenance, which increases the number of substrates used and maintenance time.
Innovation Solution
A substrate processing apparatus with a first and second substrate holder, and lifting pins that change contact positions relative to each other, allowing contaminants to be transferred to new uncontaminated areas on the substrate, reducing the need for multiple substrates and enhancing contaminant removal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are used to clean substrate holders and lifting pins by repeated contact, then contaminant removal effectiveness is improved, but the number of substrates required increases and maintenance time increases
Solution Approach 1:
The system dynamically changes the contact position between the substrate holder and the substrate during the cleaning process. By moving the contact position along the substrate surface, the same substrate can continuously provide clean contact areas for contaminant transfer, eliminating the need to switch substrates and reducing maintenance time while maintaining high contaminant removal effectiveness.
Solution Approach 2:
The invention transitions from a single-point contact cleaning method to a multi-point contact method by changing the contact position along the substrate surface. This dimensional expansion of the contact interface allows contaminants to be transferred to multiple different locations on the substrate, preventing saturation and enabling continuous effective cleaning without increasing substrate consumption.
2Reliability
If substrates are used to clean substrate holders and lifting pins by repeated contact, then contaminant removal effectiveness is improved, but the number of substrates required increases
Solution Approach 1:
The system dynamically changes the contact position between the substrate holder and the substrate during the cleaning process. By moving the contact position along the substrate surface, the same substrate can continuously provide clean contact areas for contaminant transfer, eliminating the need to switch substrates and reducing maintenance time while maintaining high contaminant removal effectiveness.
Solution Approach 2:
The invention transitions from a single-point contact cleaning method to a multi-point contact method by changing the contact position along the substrate surface. This dimensional expansion of the contact interface allows contaminants to be transferred to multiple different locations on the substrate, preventing saturation and enabling continuous effective cleaning without increasing substrate consumption.
Data Source
AI summary
A substrate processing apparatus that processes a substrate with a processing liquid, includes: a processing container; a first substrate holder configured to horizontally hold the substrate inside the processing container; a rotation drive configured to rotate the first substrate holder about a vertical rotation central axis; a second substrate holder configured to horizontally hold the substrate inside the processing container; a movement drive configured to move the first substrate holder and the second substrate holder relative to each other; and a controller configured to control the rotation drive and the movement drive, wherein the controller performs control to repeat contact between the first substrate holder and the substrate by changing a contact position of the substrate with the first substrate holder.