Substrate Holder Dust Restricting Mechanism for Semiconductor Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate holder systems generate dust during the bonding process of semiconductor substrates, leading to inadequate bonding strength and circuit operation issues due to dust trapped between the substrates and uneven pressurization.
Innovation Solution
A substrate holder system with a dust restricting mechanism, featuring an engaging member and an engagement receiving member, along with a dust restricting means that prevents dust generation during the engagement of these components, ensuring clean contact and improved bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate holder fixing mechanism is used to fix substrate holders together, then the substrate holders can be securely positioned for bonding, but dust is generated at the contact locations of the fixing mechanism
Solution Approach 1:
A dust restricting member is introduced as an intermediary component between the engaging member and engagement receiving member. This dust restricting member has a dust restricting hole that allows engagement while restricting dust generation. The intermediary structure mediates between the need for secure fixing and the need to prevent dust contamination.
Solution Approach 2:
The dust restricting member is provided with a dust restricting hole with specific dimensional characteristics (diameter smaller than the engaging member diameter, length greater than the engaging member length). This local quality control at the critical engagement interface prevents dust generation while maintaining secure fixing elsewhere in the system.
2Manufacturing precision
If substrate holders are integrated to form a layered semiconductor in a sandwiched state, then precise positioning for bonding is achieved, but contact locations in the fixing mechanism generate dust that contaminates the bonding interface
Solution Approach 1:
The dust restricting member serves as a mediator that enables the engaging member to engage with the engagement receiving member while preventing dust generation at the contact interface. This allows precise positioning to be maintained without the harmful side effect of dust contamination.
Solution Approach 2:
The dust restricting function is extracted as a separate, dedicated component (the dust restricting member with its dust restricting hole) rather than relying on the basic fixing mechanism alone. This separation allows the fixing mechanism to focus on positioning while the dust restricting member handles contamination prevention.
Data Source
AI summary
Provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate and can, together with the first substrate holder, sandwich the first substrate and the second substrate; an engagement receiving member that is provided on the second substrate holder and engages with the engaging member; and a dust restricting means for restricting generation of dust caused by the engagement of the engaging member and the engagement receiving member.