Substrate Holder Surface Layout for Precise Fusion Bonding
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Solution Overview
Problem
Existing substrate holders often result in inexact bonding due to local distortions of substrates during the bonding process, particularly during fusion bonding, caused by elastic and vibrational waves, leading to errors in the bonding result.
Innovation Solution
A substrate holder design featuring a central elevation with a larger first mounting surface than the support elevations, which reduces the pressure on the central elevation and minimizes deformation, thereby improving the bonding process by supporting substrates on a larger area and reducing vibrations through strategically positioned support elevations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate rests only partially on elevations during bonding, then rear side contamination is minimized and substrate fixing is improved, but local distortions and vibrations occur leading to inexact bonding results
Solution Approach 1:
The patent applies local quality by differentiating the mounting surface areas of different elevations. The central elevation has a larger mounting surface area to reduce pressure and minimize vibrations at the critical bonding location, while support elevations have smaller mounting surface areas to maintain substrate fixing. This non-uniform distribution of mounting surface areas addresses the contradiction by optimizing each elevation's function according to its specific role in the bonding process.
2Productivity
If the upper substrate is allowed to fall onto the lower substrate to initiate bond wave propagation, then bonding is initiated effectively, but elastic waves and vibrations are generated causing substrate displacement errors
Solution Approach 1:
The patent implements beforehand cushioning by designing the central elevation with a larger mounting surface area before the bonding process begins. This larger surface area acts as a cushion that absorbs and dampens the elastic waves and vibrations generated when the upper substrate falls onto the lower substrate. By preparing this vibration-dampening structure in advance, the patent maintains both the effectiveness of bond wave initiation and the precision of substrate alignment.
3Strength
If the mounting surface area of the central elevation is increased, then pressure on the central elevation is reduced minimizing deformation, but the substrate contact area with the holder increases potentially causing more contamination
Solution Approach 1:
The patent resolves this contradiction by applying local quality through non-uniform mounting surface area distribution across different elevations. The central elevation receives a larger mounting surface area specifically to reduce pressure and prevent deformation at the critical bonding location, while support elevations maintain smaller mounting surface areas to limit overall substrate contact and reduce contamination risk. This localized optimization balances deformation resistance with contamination prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved bonding results by reducing local distortions and vibrations, ensuring a more precise alignment and support of substrates, leading to enhanced bonding quality.
Implementation Method 1
the first mounting surface is larger than the second mounting surface... reduces the pressure on the central elevation and minimizes deformation
Implementation Method 2
substrates, which do not come into contact with a substrate holder over the whole area, but rather only partially, predominantly have soiling and contamination only at the contact points
Implementation Method 3
evacuating the intermediate space of the elevations, in order to provide a fixing element
Implementation Method 4
flooding the intermediate space with a fluid, particularly a gas, in order to achieve a physical effect... an overpressure is created in the respective segment and the substrate can be bent in a targeted manner
Implementation Method 5
What is known as a bond wave propagates, starting from this initial contact point of the two substrates, so that the two substrates are bonded along the bond wave
Implementation Method 6
One reason is the propagation of elastic and continuous waves associated with the bond wave
Implementation Method 7
the upper substrate and the lower substrate are set vibrating after contacting... the lower substrate, in particular both substrates, start to vibrate
Data Source
AI summary
The present invention relates to a substrate holder, a bonding device, a method for producing a substrate holder and a method for bonding.