Substrate Holder With Integrated Heat Pipe For Temperature Control

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Solution Overview

Problem

Conventional substrate transfer devices face challenges in maintaining appropriate temperatures during processes with different temperature requirements, leading to deviations in process rates and potential damage to wafers due to temperature differences.

Innovation Solution

A substrate holder with a ceramic main body and integrated heat pipes allows for temperature adjustment by forming a flow path for a working fluid, enabling efficient heat exchange and temperature control within the fork, thereby maintaining optimal wafer temperatures across varying processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional substrate holder without temperature control is used, then the device structure remains simple, but the wafer temperature cannot be maintained appropriately during processes with different temperature requirements, leading to process rate deviations and potential wafer damage

Engineering Contradiction:
Improvesubstrate holder temperatureVSAvoidsubstrate holder structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat pipe is integrated directly into the substrate holder, merging the temperature control function with the holding function. This allows the substrate holder to actively regulate its temperature through the phase change working fluid in the heat pipe, resolving the contradiction between temperature control capability and structural simplicity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat pipe utilizes phase transitions (evaporation and condensation) of the working fluid to transfer heat efficiently. During evaporation, the fluid absorbs heat from the substrate holder; during condensation, it releases heat back. This phase change mechanism enables effective temperature control without adding complex active cooling/heating systems

Inventive Principle:
Principle #36Phase transitions

2Reliability

If the substrate holder temperature is not controlled, then the device operation remains simple, but temperature differences cause deviations in process rates and potential damage to wafers

Engineering Contradiction:
Improvewafer protection and process consistencyVSAvoiddevice operation simplicity
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The heat pipe provides passive temperature control through its inherent phase change mechanism. The working fluid automatically circulates between evaporation and condensation phases based on temperature gradients, enabling the substrate holder to self-regulate its temperature without requiring complex external control systems or frequent operational adjustments

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The phase transitions of the working fluid provide a natural, self-regulating temperature control mechanism that enhances reliability by maintaining consistent substrate temperatures during different processes, while requiring minimal operational intervention

Inventive Principle:
Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively adjusts the temperature of the substrate holder to match process requirements, preventing damage and ensuring consistent process rates across high- and low-temperature processes, while the ceramic material withstands a wide temperature range without generating dust.

Implementation Method 1

a heat pipe including a flow path of a working fluid formed inside the main body

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

heat pipe including a flow path of a working fluid formed inside the main body

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

the ceramic material withstands a wide temperature range without generating dust

Methodology Applied
Scientific EffectThermal resistance: Thermal Insulation

Data Source

PatentUS20220139759A1Substrate holder, substrate transfer device, and method of manufacturing substrate holder
Publication Date: 2022.05.05 TOKYO ELECTRON LTD
  • US20220139759A1 patent drawing
  • US20220139759A1 patent drawing
  • US20220139759A1 patent drawing

AI summary

There is provided a substrate holder. The substrate holder that holds a substrate and is installed in a device for transferring the substrate. The substrate holder includes: a ceramic main body; and a heat pipe which includes a flow path of a working fluid. The flow path is formed inside the main body.