Substrate Holder Power Routing for Uniform Plating Thickness

The patent applies the equipotentiality principle by routing power source line members so that distances from the power source to multiple power source connecting portions become equal. This creates equal electric potential distribution across the substrate holder, eliminating the potential bias caused by unequal distances from support pillars. The power source line members are specifically configured to connect to multiple locations on the substrate holder with equal path lengths, ensuring uniform voltage application and thereby achieving uniform plating film thickness while maintaining stable support through the support pillar structure.

The patent introduces power source line members as intermediary elements between the power source and the substrate holder. These line members act as mediators that distribute power uniformly by equalizing the electrical path lengths to multiple power source connecting portions on the substrate holder. This intermediary structure eliminates the electric potential bias that would otherwise occur due to unequal distances from support pillars, while still effectively supplying power to the substrate for plating.

The patent maintains a relatively simple substrate holder structure with support pillars while improving power feeding uniformity by applying the equipotentiality principle through strategically routed power source line members. These line members are configured to create equal electrical path lengths to multiple connecting portions, ensuring that the contact member receives uniform power feeding without requiring complex restructuring of the support pillar arrangement or substrate holder geometry.