Substrate Holder with Independent Pressure Zones
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Solution Overview
Problem
Existing substrate bonding technologies face challenges in controlling attachment distortion between substrates due to anisotropy in physical properties like Young's modulus, leading to position deviations and bonding inaccuracies.
Innovation Solution
A substrate processing apparatus with a holder featuring independently controlled attracting pressure regions, including circular and annular shapes, allows for differential pressure generation and adjustment to minimize distortion by varying pressures across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform attracting pressure is applied across the entire substrate surface, then the substrate is securely held during bonding, but attachment distortion occurs due to anisotropy in physical properties like Young's modulus
Solution Approach 1:
The attraction surface is divided into multiple independent regions (first circular region and second annular region) that can be controlled separately. This segmentation allows different attracting pressures to be applied to different regions, compensating for the anisotropic physical properties of the substrate and preventing attachment distortion while maintaining secure holding.
Solution Approach 2:
Different attracting pressures are applied to different regions of the substrate based on their local physical properties. The first circular region and second annular region have independently controllable pressures, allowing the system to account for variations in Young's modulus and other anisotropic properties across the substrate surface, thereby eliminating attachment distortion.
2Manufacturing precision
If the attraction surface is divided into multiple independently controlled regions, then attachment distortion can be minimized, but the device complexity increases
Solution Approach 1:
The attraction surface is divided into two main regions (first circular region and second annular region) with independent pressure control. This segmentation achieves the goal of minimizing attachment distortion through localized pressure adjustment while keeping the number of controlled regions manageable, thus balancing precision improvement with device complexity.
Solution Approach 2:
The holder structure serves multiple functions: it provides the attraction surface, divides it into independently controllable regions, and integrates the pressure control mechanisms. This multi-functionality reduces overall system complexity by combining several functions into a single integrated component rather than requiring separate systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces attachment distortion by controlling substrate alignment and bonding accuracy, ensuring precise positioning and minimizing deviations between substrate alignment marks.
Implementation Method 1
a holder configured to hold a substrate and including, as a plurality of regions in which attracting pressures for attracting the substrate are controlled independently, a first region having a circular shape and a second region having an annular shape and disposed at an outside of the first region in a diametrical direction
Data Source
AI summary
A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including, as multiple regions in which attracting pressures for attracting the substrate are controlled independently, a first region having a circular shape and a second region having an annular shape and disposed at an outside of the first region in a diametrical direction; multiple attracting pressure generators configured to independently generate the attracting pressures respectively in the multiple regions forming the attraction surface; multiple attracting pressure adjusters configured to independently adjust the attracting pressures respectively generated by the attracting pressure generators; and a controller configured to control the multiple attracting pressure generators and the multiple attracting pressure adjusters. The controller generates different attracting pressures in at least a part of the first region and in at least a part of the second region.