Substrate Holder Pressure Zoning for Stress-Relieved Bonding
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Solution Overview
Problem
In substrate processing apparatuses, residual stress on substrates due to bending can lead to misalignment and inefficient bonding, as existing technologies often fail to effectively manage stress distribution during the bonding process.
Innovation Solution
The substrate processing apparatus employs a holder with a circular central region and an annular outer region, utilizing first and second attracting pressure generators and an external force applier to manage substrate attraction and stress relief, specifically applying external forces to alleviate convex and concave bending in substrates, ensuring uniform stress distribution and precise bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate is simply attracted to the holder using conventional methods, then the substrate can be held in place, but residual stress accumulates due to bending causing misalignment and bonding issues
Solution Approach 1:
The holder's attraction surface is divided into a central region and an outer region, with independent attracting pressure generators for each region. This segmentation allows differential pressure control to manage substrate stress distribution, preventing bending while maintaining holding reliability.
Solution Approach 2:
Different regions of the holder apply different attracting pressures to different parts of the substrate. The central region and outer region have customized pressure characteristics that match the substrate's stress distribution requirements, improving both alignment and bonding precision.
2Force
If uniform attracting pressure is applied across the entire substrate, then the substrate is securely held, but stress distribution becomes non-uniform causing convex or concave bending
Solution Approach 1:
The attraction surface is segmented into central and outer regions with independent pressure control. This allows the holding force to be distributed non-uniformly, applying different pressures to different regions to maintain substrate flatness while securing the substrate.
Solution Approach 2:
The attracting pressure parameter is varied across different regions of the substrate. By changing the pressure distribution pattern (higher in center, lower in outer regions or vice versa), the system maintains both adequate holding force and substrate flatness.
3Ease of operation
If the substrate is held without external force application, then the holding process is simple, but residual stress remains high leading to processing defects
Solution Approach 1:
External force is applied to the substrate in the outer region before final bonding to preemptively relieve residual stress and prevent bending. This preliminary action ensures the substrate is in the correct stress state before the bonding process begins.
Solution Approach 2:
The outer region of the holder acts as an intermediary mechanism that applies controlled external force to the substrate. This intermediary structure enables stress management without requiring direct manual intervention, maintaining ease of operation while improving precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces residual stress and promotes precise alignment and bonding of substrates, enhancing the manufacturing process by ensuring accurate and reliable bonding of substrates with improved stress distribution.
Implementation Method 1
a first attracting pressure generator configured to generate an attracting pressure in the central region to attract the substrate to the holder; a second attracting pressure generator configured to generate an attracting pressure in the outer region to attract the substrate to the holder
Implementation Method 2
an external force applier configured to apply an external force to the substrate in the outer region in a direction in which the substrate becomes farther from the holder
Data Source
AI summary
A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The holder includes a first attracting pressure generator configured to generate an attracting pressure in the central region to attract the substrate to the holder; a second attracting pressure generator configured to generate an attracting pressure in the outer region to attract the substrate to the holder; and an external force applier configured to apply an external force to the substrate in the outer region in a direction in which the substrate becomes farther from the holder.