Substrate Holding Structure With Shielding Plates for Thermal Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing holding devices for plasma-assisted deposition exhibit uneven temperature distribution between inner and outer carrier plates, leading to inefficient layer deposition during chemical vapor deposition processes, particularly in multilayer processes where different temperatures are required.
Innovation Solution
The introduction of shielding plates that are positioned to block direct thermal radiation to the outer carrier plates, ensuring they heat and cool at a similar rate to the inner plates, thereby achieving a more uniform temperature distribution across all carrier plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If outer carrier plates are exposed to direct thermal radiation during heating, then they heat up faster, but this creates temperature differences between inner and outer carrier plates leading to uneven layer deposition
Solution Approach 1:
Shielding plates are introduced as intermediary elements positioned between the thermal radiation source and the outer carrier plates. These shielding plates mediate the heat transfer process by absorbing and redistributing thermal radiation, preventing direct exposure of the outer carrier plates while maintaining overall heating efficiency and temperature uniformity across all carrier plates.
2Duration of action of moving object
If outer carrier plates are exposed to direct thermal radiation, then heating is faster, but cooling also occurs more rapidly creating temperature instability
Solution Approach 1:
The shielding plates are positioned in advance to cushion the outer carrier plates against direct thermal radiation fluctuations. This pre-positioned protection stabilizes the thermal environment of the carrier plates during both heating and cooling phases, reducing temperature oscillations and improving thermal stability throughout the deposition process.
3Manufacturing precision
If shielding plates are added to block thermal radiation, then temperature uniformity improves, but device complexity increases
Solution Approach 1:
The shielding plates are designed with the same structural characteristics as the carrier plates (parallel arrangement, similar dimensions, substrate-free design), creating a homogeneous overall structure. This approach achieves temperature uniformity while maintaining structural consistency and avoiding significant increases in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for homogeneous temperature profiles across all substrate-carrying carrier plates, reducing temperature-dependent inhomogeneities and shortening the time required for thermal stabilization, resulting in more efficient and uniform layer deposition.
Implementation Method 1
Heating is achieved by thermal radiation acting from outside towards the holding device. However, the inner and outer carrier plates heat up at different rates.
Implementation Method 2
the shielding plates at least largely shade the carrier outer plates such that the carrier outer plates are protected from direct incurrence of heat radiation from components of the deposition device surrounding the holding device
Data Source
Figure 1
AI summary
The invention relates to a holding device for holding a plurality of substrates (4) for plasma-enhanced deposition of a layer from the gas phase on the substrates (4), having: inner carrier plates (1), which are arranged parallel to one another and are each designed to carry substrates (4) on mutually opposite sides; outer carrier plates (2), which are arranged parallel to the inner carrier plates (1) and have an inner side facing the inner carrier plates (1), and an outer side facing away from the inner carrier plates (1), wherein each outer carrier plate (2) is designed to carry one or more substrates (4) on its inner side and to be free of substrates on its outer side; and shielding plates (3) which are each arranged at a distance from the outer side of the outer carrier plate (2) such that, as seen in a plan view of the outer carrier plates (2), the shielding plates (3) at least predominantly shield the outer carrier plates (2), wherein each shielding plate (3) is designed to be free of substrates. The invention also relates to the use of the holding device as a holding device for substrates (4) in plasma-enhanced deposition from the gas phase.