Substrate Holder Vacuum Layout for Particle-Safe Laser Dicing
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Solution Overview
Problem
Conventional substrate processing systems face issues such as laser damage to substrate support assemblies, particle generation, increased downtime, decreased yield, material waste, and high stress build-up leading to mechanical failure and poor reliability during dicing operations.
Innovation Solution
A substrate holder with a chuck base featuring a chucking vacuum line and a particle vacuum line, along with chuck posts and die collect components, designed to secure substrates and extract particles, minimize laser impact, and reduce stress concentrations by using rounded or hollowed-out corners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional substrate support assemblies are used during laser processing and dicing, then substrate processing can be performed, but laser damage to the support assembly occurs and particles are generated
Solution Approach 1:
The patent extracts the harmful function of the substrate support assembly by removing it from the laser path. The support assembly is positioned below the substrate plane, eliminating direct laser impact while maintaining substrate holding capability during processing
Solution Approach 2:
The patent introduces an intermediary structure where the substrate is held above the support assembly surface, creating a gap that prevents direct laser interaction with the support assembly while maintaining mechanical support and vacuum chucking functionality
2Productivity
If conventional substrate processing is performed, then substrates can be processed, but particle generation and redeposition occur
Solution Approach 1:
The patent converts the harmful particle generation into a beneficial containment system by using the support assembly surface as a collection trap. Particles generated during processing are captured and held by the support assembly rather than being redeposited on the substrate, transforming a contamination problem into a controlled collection mechanism
Solution Approach 2:
The patent extracts particles from the processing environment by providing a dedicated collection surface below the substrate plane, removing particles from the circulation path and preventing their redeposition on processed substrates
3Productivity
If conventional dicing operations are performed, then devices can be cut from substrates, but stress build-up leads to mechanical failure
Solution Approach 1:
The patent applies local quality by providing enhanced support specifically at corner regions where devices will be diced. The support assembly surface is positioned to maintain uniform stress distribution across the substrate, with particular attention to corner regions that experience highest stress during dicing operations
Solution Approach 2:
The patent provides beforehand cushioning by maintaining continuous substrate support on the support assembly surface during dicing operations. This pre-positioned support prevents stress concentrations and mechanical failure before they can occur during the cutting process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate holder reduces damage, increases yield and reliability, decreases downtime and material waste, and lowers energy consumption by preventing particle redeposition and stress-related failures.
Implementation Method 1
a particle vacuum line to extract particles produced from substrate processing
Implementation Method 2
The chucking vacuum line is routed through the one or more chuck posts to chuck a substrate
Data Source
AI summary
A substrate holder includes a chuck base forming a chucking vacuum line and a particle vacuum line. The particle vacuum line is to extract particles produced from substrate processing. The substrate holder further includes one or more chuck posts extending from an upper surface of the chuck base. The chucking vacuum line is routed through the one or more chuck posts to chuck a substrate. The substrate holder further includes one or more die collect components disposed on the upper surface of the chuck base. A device is to be supported by at least one of the one or more die collect components responsive to being cut from the substrate.