Substrate Processing Holding Layers for Contaminant Removal
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Solution Overview
Problem
Existing substrate processing methods struggle to efficiently remove contaminants from substrates with uneven patterns, as the removal capacity of holding layers varies by substance type and region, leading to incomplete removal when different substances are exposed on the substrate surface.
Innovation Solution
A substrate processing method involving a preprocessing liquid to form a holding layer for initial removal targets, followed by a processing liquid to form another holding layer, with specific removal capacities for each region, allowing for staged separation and efficient removal of contaminants, while minimizing damage to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single holding layer is formed to remove removal targets from the substrate surface, then the removal process is simplified, but the removal capacity is insufficient when different substances are exposed on different regions of the substrate
Solution Approach 1:
The patent divides the removal process into multiple stages by forming multiple holding layers (preprocessing holding layer and processing holding layer) with different removal capacities. Each holding layer is designed to remove specific types of removal targets from different regions of the substrate, ensuring complete removal across all surface substances while maintaining processability.
Solution Approach 2:
The patent applies local quality by creating holding layers with spatially varying removal capacities. The preprocessing holding layer has higher removal capacity for certain regions, while the processing holding layer targets other regions, allowing each layer to be optimized for specific local conditions on the substrate surface.
2Reliability
If a holding layer with high removal capacity is used to remove all types of removal targets, then removal completeness is improved, but damage to the substrate and uneven patterns increases
Solution Approach 1:
The patent segments the removal function across multiple holding layers, each with moderate removal capacity tailored to specific removal targets. This prevents any single layer from requiring excessively high removal capacity that would cause substrate damage, while collectively achieving complete removal through the multi-stage process.
Solution Approach 2:
The preprocessing holding layer performs preliminary removal of certain removal targets before the main processing holding layer is applied. This preliminary action reduces the burden on subsequent layers and prevents the need for any single layer to have excessively high removal capacity that would damage the substrate.
3Reliability
If multiple holding layers with different removal capacities are formed to address different surface substances, then removal effectiveness is improved, but the process complexity increases
Solution Approach 1:
While the patent does segment the removal process into multiple holding layers, each layer follows a similar formation and removal mechanism. This standardized segmentation reduces the complexity increase by maintaining procedural consistency across layers while achieving enhanced removal effectiveness through their combined action.
Solution Approach 2:
The patent creates a universal multi-stage holding layer framework that can handle different types of removal targets and surface substances. The same basic process steps (formation, solidification, removal) are applied universally across multiple layers, allowing the system to address diverse removal challenges without proportionally increasing operational complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures efficient removal of contaminants from substrates with varying surface substances by utilizing preprocessing and processing films with tailored removal capacities, effectively addressing the challenge of uneven patterns and substance variations.
Implementation Method 1
a preprocessing film forming step of solidifying or curing the preprocessing liquid supplied to the surface of the substrate and forming a preprocessing film, which holds a first removal target present on the surface of the substrate, on the surface of the substrate
Implementation Method 2
a processing film forming step of solidifying or curing the processing liquid supplied to the surface of the substrate and forming a processing film, which holds the first removal target present on the surface of the substrate, on the surface of the substrate
Data Source
AI summary
A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid. A removal capacity for the processing film to remove the first removal target present in the second region is higher than a removal capacity for the preprocessing film to remove the first removal target present in the second region, and a removal capacity for the preprocessing film to remove the first removal target present in the first region is higher than a removal capacity for the processing film to remove the first removal target present in the first region.