Substrate Holding Structure for Particle-Safe Vacuum Deposition
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Solution Overview
Problem
In sputtering apparatuses, the accumulation of deposits on clamping mechanisms leads to particle generation, causing deposition defects, while omitting clamping mechanisms results in inadequate substrate alignment accuracy.
Innovation Solution
A film formation apparatus with a holding device that includes a deposition preventing plate, a holder, and a position setter with rollers that contact the substrate's edge to maintain alignment and prevent particle generation by separating the deposition preventing plate and holder outside the chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a clamping mechanism is provided to hold the substrate, then substrate alignment accuracy is maintained, but deposits accumulate on the clamping mechanism causing particle generation and deposition defects
Solution Approach 1:
The harmful function (deposit accumulation) is extracted from the holding device by providing a deposition preventing plate that covers the holding device, separating the substrate holding function from the deposition prevention function
Solution Approach 2:
A deposition preventing plate is introduced as an intermediary component between the holding device and the substrate, preventing deposits from accumulating on the holding device while allowing the holding device to maintain substrate alignment
2Object-generated harmful factors
If the clamping mechanism is omitted to reduce particle generation, then particle generation is reduced, but substrate alignment accuracy cannot be sufficiently maintained
Solution Approach 1:
The harmful function (particle generation from deposits) is extracted by removing the clamping mechanism and replacing it with a holding device combined with a deposition preventing plate
Solution Approach 2:
The deposition preventing plate acts as an intermediary that enables the holding device to maintain substrate alignment without accumulating deposits that would generate particles
3Object-generated harmful factors
If a deposition preventing plate is added to prevent particle generation, then particle generation is reduced, but the device complexity increases
Solution Approach 1:
The deposition preventing plate serves multiple functions: it prevents deposits from accumulating on the holding device, maintains substrate alignment accuracy, and reduces particle generation, making the added complexity worthwhile
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces particle generation and maintains substrate alignment accuracy even with increased deposition amounts, preventing defects and breakage during the deposition process.
Implementation Method 1
a roller 16 that comes into contact with a peripheral edge end surface portion 11b of the substrate 11
Implementation Method 2
a deposition preventing plate 15 that covers a region to which the deposition material adheres in the holding device 10
Implementation Method 3
a holder 13 that holds the substrate 11 to be processed
Data Source
AI summary
A film formation apparatus of the present invention is a film formation apparatus which performs deposition on a substrate to be processed, and includes a supply device that is disposed in an evacuable vacuum chamber and supplies a deposition material, and a holding device that holds the substrate to be processed during deposition. The holding device includes a deposition preventing plate that covers a region to which the deposition material is adhered in the holding device, a holder that holds the substrate to be processed, and a position setter that sets a position of the substrate to be processed when the deposition preventing plate and the holder sandwich and hold the substrate to be processed. The position setter includes a roller that comes into contact with a peripheral edge end surface portion of the substrate to be processed.