Substrate Holding Device Protrusion Base Angle Optimization
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Solution Overview
Problem
Existing substrate holding devices with conical frustum protrusions of 45° base angle face issues with increased surface irregularity and particle adhesion due to polishing, leading to decreased production yield in semiconductor manufacturing, and the method of forming grooves is difficult and economically unfavorable.
Innovation Solution
A substrate holding device with protrusions having a base angle of 70° to 85°, formed using laser processing, which reduces the contact area and probability of particle adhesion, and a manufacturing method that combines abrasive blasting and laser processing to create a sharp conical frustum shape, making it easier and more cost-effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the contact area between protrusions and substrate is reduced by polishing top portions, then particle adhesion is reduced, but the surface roughness of top portions increases and contact area increases considerably
Solution Approach 1:
The patent changes the geometric parameter of the protrusions by increasing the base angle from the conventional 45° to 70° or more. This parameter change creates a sharper protrusion shape that inherently reduces the contact area with the substrate, thereby reducing particle adhesion while maintaining sufficient structural strength without requiring extensive polishing that would increase surface roughness
2Object-affected harmful factors
If grooves are formed in top surfaces of protrusions to reduce contact area, then particle entry frequency is reduced, but the manufacturing process becomes difficult and economically disadvantageous
Solution Approach 1:
Instead of adding complex groove structures to the protrusions, the patent simplifies the manufacturing approach by changing only the base angle parameter of the protrusions to 70° or more. This single parameter change achieves the same effect of reducing particle entry frequency while being significantly easier and more economical to manufacture using conventional abrasive blasting processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the increase in contact area and particle adhesion, reducing surface irregularity and improving production yield while being easier and less costly to manufacture compared to existing methods.
Implementation Method 1
formed using laser processing, which reduces the contact area and probability of particle adhesion
Implementation Method 2
The protrusions are formed by abrasive blasting
Data Source
AI summary
A substrate holding device includes a base body that has a flat plate-like shape and that includes gas passages that open in an upper surface of the base body, and a plurality of protrusions that protrude from the upper surface of the base body. At least an upper part of each of the protrusions has a conical frustum shape having a base angle of 70° or more and 85° or less.