Substrate Holding System with Rotatable Carrier for Precision Machining
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Solution Overview
Problem
Current systems for holding and processing substrates, especially elongated or filigree tools, are inefficient and prone to substrate damage due to high handling costs and risks, particularly during manual re-batching and transport.
Innovation Solution
A holding system with a covering area and multiple fixing elements, a body for receiving the fixing elements, and a positioning element that allows substrates to be securely fixed and processed within a machining area, enabling rotation and handling in various orientations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are manually handled and re-batched before processing, then substrates can be prepared for treatment, but handling costs increase and risk of substrate damage increases
Solution Approach 1:
The holding system segments substrates into individual slots within a carrier, allowing each substrate to be held separately and securely. This segmentation eliminates the need for manual re-batching while maintaining substrate integrity during transport and processing.
Solution Approach 2:
The holding system acts as an intermediary device between substrate storage and processing equipment. It provides a standardized interface that automates substrate transfer, eliminating direct manual handling and reducing damage risk while maintaining operational ease.
2Manufacturing precision
If substrates are held in fixed positions during processing, then machining precision is maintained, but handling flexibility and rotation capability are limited
Solution Approach 1:
The holding system incorporates rotatable carriers that can dynamically adjust substrate orientation while maintaining secure fixation during machining. The system transitions from static to dynamic holding, allowing substrate rotation to different positions (e.g., upside down or horizontally) while preserving machining precision through controlled positioning.
Solution Approach 2:
The holding system provides multi-functional capability by enabling substrates to be held in multiple orientations (vertical, horizontal, upside down) while maintaining machining precision. The universal design accommodates different processing requirements without compromising accuracy or flexibility.
3Manufacturing precision
If individual substrates are processed separately, then processing quality is maintained, but handling effort and processing time increase
Solution Approach 1:
The holding system merges multiple substrates into a single carrier unit that can be processed together as one batch. This combining approach maintains individual substrate quality through secure positioning while dramatically reducing handling effort and increasing processing efficiency by treating multiple substrates simultaneously.
Data Source
AI summary
The invention relates to a holding system (1) for holding substrates (12) for use in a surface processing system having a covering area (20), comprising a plurality of fixing elements (2), a body (24) arranged within the covering area (20) for receiving the fixing elements (2), and a positioning element (26) for adjusting the covering and a machining area (20, 22), wherein a plurality of substrates (12) can be fixed by the fixing elements (2) and processed within the machining area (22).