Substrate Holding with Segmented Vacuum and Bernoulli Suction
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Solution Overview
Problem
Existing substrate holding techniques face challenges in securely gripping warped substrates, leading to potential misalignment during processing due to suction failures, which often require large vacuum pumps and increased apparatus size and cost.
Innovation Solution
A substrate processing apparatus featuring a holding surface with both vacuum suction ports and Bernoulli suction ports, including a circular and annular region configuration, embankments, and protrusions to correct warpage and maintain suction without marking the substrate's back surface, allowing for secure holding of warped substrates with a simple configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum suction ports are used to hold the substrate, then the substrate can be held under suction, but the suction is relieved through gaps created by warpage leading to suction failure
Solution Approach 1:
The holding surface is divided into multiple regions (circular region and annular region) with different suction mechanisms. The circular region uses vacuum suction ports while the annular region uses Bernoulli suction ports. This segmentation allows each region to address specific warpage patterns, improving overall suction reliability without requiring a single large vacuum pump.
Solution Approach 2:
Different suction mechanisms are applied to different locations on the holding surface based on local warpage characteristics. The central circular region with vacuum suction addresses convex warpage, while the surrounding annular region with Bernoulli suction addresses concave warpage. This local quality approach ensures effective suction holding across the entire substrate surface despite variations in warpage.
2Reliability
If large sucking force is exerted to prevent suction failure on warped substrates, then substrate holding reliability improves, but large vacuum pumps and large-scale piping systems are required increasing apparatus size and cost
Solution Approach 1:
The suction system is segmented into multiple smaller suction zones (circular region with vacuum ports, annular region with Bernoulli ports) rather than using a single large suction system. This allows the apparatus to achieve reliable substrate holding through distributed smaller suction forces rather than requiring a single large vacuum pump and extensive piping.
Solution Approach 2:
The invention utilizes Bernoulli suction ports that employ pneumatic principles to generate suction force. By ejecting gas from holes in the holding surface, the Bernoulli effect creates suction that attracts the substrate without requiring large mechanical vacuum pumps, thereby reducing apparatus size while maintaining holding reliability.
3Manufacturing precision
If uniform suction is applied across the holding surface, then the substrate can be held, but warped substrates create gaps that relieve negative pressure causing misalignment
Solution Approach 1:
The holding surface is segmented into distinct suction zones with different mechanisms. The circular region in the center uses vacuum suction while the annular region around it uses Bernoulli suction. This segmentation allows the system to maintain effective suction across the entire substrate surface even when warpage creates gaps, preventing misalignment while adapting to local surface variations.
Solution Approach 2:
Different suction mechanisms are deployed in different locations to match local warpage patterns. The central vacuum suction addresses convex warpage in the middle region, while the Bernoulli suction in the annular region handles concave warpage at the edges. This local quality approach ensures both suction effectiveness and positioning accuracy across the entire substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively corrects warpage and securely holds substrates under suction, preventing misalignment and reducing the need for large vacuum systems, thus enhancing processing accuracy and reducing costs.
Implementation Method 1
at least one vacuum suction port formed in the holding surface and configured to attract the substrate to the holding surface by vacuum suction
Implementation Method 2
a plurality of Bernoulli suction ports formed in the holding surface and configured to attract the substrate to the holding surface by Bernoulli suction
Data Source
AI summary
A drawing apparatus which performs a drawing process on a substrate includes a holding plate having a holding surface configured to be opposed a back surface of the substrate, a vacuum suction port formed in the holding surface and configured to attract the substrate to the holding surface by vacuum suction, and a plurality of Bernoulli suction ports formed in the holding surface and configured to attract the substrate to the holding surface by Bernoulli suction. The holding surface includes a circular region disposed concentrically with the center of the holding surface, and an annular region disposed concentrically with the circular region. At least one of the Bernoulli suction ports is disposed in the circular region, and at least one of the Bernoulli suction ports is disposed in the annular region.