Substrate Holding Structure for Warpage-Stable Vacuum Mounting
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Solution Overview
Problem
Warped substrates pose challenges during mounting and detaching due to sliding, vacuum leakage, and positional instability, making stable adsorption and handling difficult on conventional mounting stages.
Innovation Solution
A substrate holding mechanism featuring multiple holding sections with protrusions and a lifting/lowering mechanism, along with a horizontal moving mechanism, securely holds and corrects the position of warped substrates using a combination of vacuum adsorption and mechanical contact to prevent sliding and leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional mounting stage with a single flat surface is used, then the structure is simple, but warped substrates cannot be stably adsorbed due to sliding and vacuum leakage
Solution Approach 1:
The mounting stage is divided into multiple holding sections (first, second, third, and fourth holding sections) arranged around the substrate's peripheral section. Each holding section independently holds a corresponding peripheral section of the substrate, allowing localized adsorption control that accommodates substrate warpage while maintaining overall stability.
Solution Approach 2:
The holding sections are configured to hold the substrate not only from the lower surface but also from the peripheral side surfaces. This multi-dimensional holding approach prevents sliding and maintains vacuum adsorption effectiveness even when the substrate is warped, as the side holding provides additional contact points.
2Reliability
If vacuum adsorption is applied to warped substrates, then adsorption force is provided, but vacuum leakage occurs due to gaps between the substrate and mounting stage
Solution Approach 1:
The holding sections extend to hold the substrate's peripheral side surfaces in addition to the lower surface. This side holding capability seals gaps that would otherwise cause vacuum leakage, allowing effective vacuum adsorption even when the substrate is warped and cannot maintain full contact with the mounting stage surface.
3Ease of operation
If warped substrates are mounted on a flat stage, then mounting is simple, but positional instability and sliding occur during handling
Solution Approach 1:
The mounting stage is segmented into multiple holding sections that independently contact different peripheral sections of the substrate. This segmentation allows each section to adapt to local warpage variations while collectively providing stable positional control, preventing sliding during substrate handling operations.
Solution Approach 2:
Each holding section is positioned to correspond to a specific peripheral section of the substrate, providing localized holding force. This local quality approach allows the system to accommodate non-uniform warpage across the substrate while maintaining overall positional stability through coordinated action of all holding sections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mechanism effectively stabilizes warped substrates during mounting and detaching, ensuring secure adsorption and preventing vacuum leakage and positional deviations, allowing for precise alignment and efficient handling.
Implementation Method 1
a mounting stage 110 on which a substrate W is mounted
Implementation Method 2
a lower surface 122 that pushes down an upper surface of the peripheral section of the substrate W mounted on the mounting stage 110
Implementation Method 3
a protrusion 130 that is provided on the plurality of holding sections 120 and that contacts an end surface of the substrate W mounted on the mounting stage 110 to correct a position of the substrate W
Data Source
AI summary
A substrate holding mechanism includes: a mounting stage on which a substrate is mounted; a plurality of holding sections each of which includes an upper surface that holds a lower surface of a peripheral section of the substrate and includes a lower surface that pushes down an upper surface of the peripheral section of the substrate mounted on the mounting stage; a protrusion that is provided on the plurality of holding sections and that contacts an end surface of the substrate mounted on the mounting stage to correct a position of the substrate; a lifting and lowering mechanism configured to lift and lower the plurality of holding sections; and a horizontal moving mechanism configured to horizontally move the plurality of holding sections.