Electronic Device Substrate Hole Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face challenges in achieving a narrow frame and low cost due to the requirement of additional wiring substrates and complex connections between conductive layers, which increases the size and cost of the device.
Innovation Solution
The electronic device incorporates a first substrate with a conductive layer, a second substrate with a basement and a conductive layer, an insulating layer, and a connecting material that electrically connects the conductive layers through strategically designed holes, eliminating the need for additional wiring substrates by increasing the contact area and reducing the frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional wiring substrates and complex connections are used to connect conductive layers, then connection reliability is improved, but device complexity and frame size increase
Solution Approach 1:
The patent merges the functions of multiple separate wiring substrates into a single integrated substrate structure. The first and second substrates are directly connected through penetrating holes with conductive material, eliminating the need for additional intermediate wiring substrates while maintaining electrical connection reliability between conductive layers.
Solution Approach 2:
The patent extracts and eliminates the unnecessary additional wiring substrates from the device structure. By using direct penetrating holes through the substrates with conductive material, the design removes redundant connection layers while preserving the essential electrical connectivity function.
2Reliability
If additional wiring substrates are used to connect conductive layers, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple wiring substrate functions into a single substrate structure, reducing the total number of components that need to be manufactured and assembled. This integration directly reduces manufacturing complexity and cost while maintaining reliable electrical connections through the penetrating hole structure.
Solution Approach 2:
The patent employs a simpler, more cost-effective substrate structure that eliminates expensive additional wiring substrates. The direct connection method using penetrating holes and conductive material provides a more economical manufacturing approach compared to complex multi-layer wiring substrate assemblies.
3Length of moving object
If the frame width is reduced, then device compactness is improved, but connection reliability between conductive layers deteriorates
Solution Approach 1:
The patent transitions the connection approach from lateral routing through additional wiring substrates to vertical penetration through holes in the substrates. This dimensional change allows for shorter connection paths and reduced frame width while maintaining or improving connection reliability through direct electrical contact via conductive material filling the penetrating holes.
4Reliability
If additional wiring substrates are used, then electrical connection between conductive layers is improved, but the number of components and assembly steps increases
Solution Approach 1:
The patent merges multiple separate wiring substrate components into a single integrated substrate structure, directly reducing the number of parts that need to be assembled. The electrical connection between conductive layers is achieved through the integrated penetrating hole structure, eliminating multiple assembly steps and improving manufacturing productivity.
Data Source
AI summary
In one embodiment, an electronic device includes first and second substrates, an insulating layer, and a connecting material. The first substrate includes a first conductive layer. The second substrate includes a basement having first and second surfaces, a second conductive layer on the second surface, and a first hole penetrating through the basement. The insulating layer is arranged between the first conductive layer and the basement, and has a second hole. The connecting material connects conductive layers via holes. The first hole has a first opening on a first surface side. The second hole has a third opening on a first conductive layer side which is larger than the first opening.