Substrate Surface Hydrophilization Feedback for Post-Polish Cleaning
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Solution Overview
Problem
The existing substrate cleaning apparatus faces challenges in ensuring sufficient hydrophilization of the substrate surface after polishing, leading to difficulties in removing polishing agents, which can result in incomplete cleaning and potential defects in semiconductor devices.
Innovation Solution
A substrate cleaning apparatus comprising a chamber, support unit, supply unit, imaging unit, determination unit, and cleaning unit, where the supply unit applies a cleaning liquid, the imaging unit captures images of the substrate, and the determination unit adjusts the hydrophilization based on image analysis to ensure complete hydrophilization before proceeding with cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is transferred from the polishing apparatus to the brush-cleaning device without sufficient hydrophilization, then the cleaning process can proceed, but the polishing agents become fixed to the substrate and cannot be removed effectively
Solution Approach 1:
The system performs preliminary hydrophilization treatment on the substrate surface before transfer by ejecting ozone water or cleaning liquid for a predetermined time in the receiving chamber, ensuring the surface is adequately hydrophilized to prevent polishing agent adhesion during subsequent handling and cleaning operations
Solution Approach 2:
The imaging unit captures images of the substrate surface to detect the hydrophilization state, and this information is fed back to the control unit which adjusts the ejection time of ozone water or cleaning liquid to achieve optimal hydrophilization before transfer and cleaning operations
2Reliability
If the ejection time of ozone water or cleaning liquid is extended to ensure sufficient hydrophilization, then the substrate surface becomes more hydrophilic, but the processing time increases
Solution Approach 1:
The imaging unit provides real-time feedback on the hydrophilization state of the substrate surface, enabling the control unit to precisely control the ejection duration of ozone water or cleaning liquid, thereby achieving optimal hydrophilization in minimal time and avoiding unnecessary extension of processing time
Solution Approach 2:
The system replaces subjective judgment of hydrophilization with objective image-based detection, using the imaging unit to capture and analyze substrate surface characteristics, which enables precise, automated control of the hydrophilization process duration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that the substrate is cleaned in a fully hydrophilic state, effectively preventing the adhesion of polishing agents and enhancing the removal of contaminants, thereby reducing defects in semiconductor devices.
Implementation Method 1
The supply unit supplies a cleaning liquid to the polished surface of the substrate supported by the support unit to hydrophilize the polished surface
Implementation Method 2
The imaging unit captures an image of the polished surface supplied with the cleaning liquid from a lateral side of the substrate
Data Source
AI summary
According to one embodiment of the present disclosure, a substrate cleaning apparatus includes a hydrophilization chamber connected to a polishing apparatus and that accommodates a substrate having a polished surface polished by the polishing apparatus; a support provided in the hydrophilization chamber; a liquid supply unit that supplies a cleaning liquid to the polished surface of the substrate to hydrophilize the polished surface; an imaging unit that captures an image of the polished surface supplied with the cleaning liquid; a determination unit that determines whether hydrophilization is achieved on a basis of the image; an adjustment unit that adjusts the supply of the cleaning solution by the liquid supply unit depending on a determination result obtained by the determination unit; and a cleaning chamber connected to the hydrophilization chamber and that cleans the polished surface hydrophilized by the cleaning liquid.