Substrate Hydrophobizing for Resist Pattern Dimensional Accuracy
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Solution Overview
Problem
Conventional substrate treating methods face challenges in achieving high dimensional accuracy of resist patterns due to variability in resist pattern size with exposure conditions and post-exposure heating treatments.
Innovation Solution
A substrate treating method that determines optimal hydrophobizing conditions based on target dissolved area sizes, adjusting gas concentration, retention time, and temperature to control the contact angle on the substrate surface, thereby improving the dimensional accuracy of resist patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional exposure and post-exposure heating treatments are used to form resist patterns, then the resist pattern can be obtained, but the dimensional accuracy of the resist pattern deteriorates due to variability with exposure conditions and heating temperature
Solution Approach 1:
The invention applies preliminary hydrophobizing treatment to the substrate surface before forming the resist film. By modifying the substrate surface properties in advance through controlled hydrophobizing conditions (gas concentration, retention time, temperature), the resist pattern dimensional accuracy is improved from the outset, reducing variability caused by subsequent exposure and post-exposure heating conditions.
Solution Approach 2:
The invention changes the physical and chemical parameters of the substrate surface by controlling hydrophobizing conditions. Specifically, it adjusts gas concentration, retention time, and temperature during hydrophobizing treatment to achieve desired contact angles, thereby controlling the dissolved area size and improving resist pattern dimensional accuracy.
2Manufacturing precision
If the hydrophobizing treating condition is adjusted to control dissolved area size, then the dimensional accuracy of resist pattern is improved, but the complexity of the treating process increases
Solution Approach 1:
The invention controls the hydrophobizing process by adjusting key parameters such as gas concentration, retention time, and temperature. By systematically varying these parameters, the contact angle on the substrate surface is controlled, which directly influences the dissolved area size and improves dimensional accuracy without requiring complex additional equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively regulates the size of dissolved areas in resist patterns, enhancing their dimensional accuracy and consistency by precisely controlling the hydrophobizing conditions, leading to improved resist pattern formation.
Implementation Method 1
a treating step for hydrophobizing the surface of the substrate with the treating condition determined in the determining step
Implementation Method 2
the size of dissolved areas in a resist pattern is variable with treating conditions for hydrophobizing the surfaces of substrates
Data Source
AI summary
A substrate treating method includes a determining step for determining a treating condition for hydrophobizing a surface of a substrate, based on a target regarding a dissolved area size in a resist pattern, and a treating step for hydrophobizing the surface of the substrate with the treating condition determined in the determining step before forming resist film on the surface of the substrate.