Component Mounting System Substrate ID Tracing Efficiency

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Solution Overview

Problem

Existing component mounting systems face efficiency reductions and inconsistencies in substrate tracing due to frequent substrate ID verification at each apparatus, and inconsistencies in mounting history when substrates are swapped or removed.

Innovation Solution

A component mounting system with recognition means for reading substrate IDs and state detection means to determine if substrates can be inserted or removed, where the substrate ID is acquired and transmitted from upstream apparatuses, and a prescribed number of IDs are read out when substrates are in a state to be inserted or removed, ensuring consistent tracing and minimizing efficiency losses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the substrate ID is read out at each component mounting apparatus, then verification of the substrate is reliably performed, but production efficiency of the mounting substrate is reduced

Engineering Contradiction:
Improveverification reliabilityVSAvoidproduction efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The substrate ID is read out in advance at the upstream component mounting apparatus before the substrate is transferred to downstream apparatuses. This preliminary reading ensures the ID is captured early in the process, eliminating the need for repeated readings at each subsequent apparatus while maintaining verification reliability.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The substrate ID information is copied and transmitted from the upstream component mounting apparatus to downstream apparatuses through the substrate transport mechanism. Instead of each apparatus independently reading the ID, the information is propagated along the production line, reducing redundant operations and improving efficiency.

Inventive Principle:
Principle #26Copying

2Productivity

If the substrate ID is read out only by the front component mounting apparatus, then production efficiency is maintained, but inconsistencies are generated in the subsequent tracing when substrates are swapped

Engineering Contradiction:
Improveproduction efficiencyVSAvoidtracing consistency
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system incorporates feedback mechanisms where downstream component mounting apparatuses can detect substrate presence and communicate with upstream apparatuses. When a substrate is detected at a downstream apparatus, the system verifies the substrate ID through feedback loops, ensuring tracing consistency even when substrates are swapped or removed during the mounting process.

Inventive Principle:
Principle #23Feedback

3Productivity

If the substrate ID is transmitted from upstream apparatus, then production efficiency is improved, but tracing inconsistencies occur when substrates are inserted or removed

Engineering Contradiction:
Improveproduction efficiencyVSAvoidtracing accuracy
Core Design Contradiction:
ProductivityVSLoss of information

Solution Approach 1:

The system dynamically adjusts its substrate ID verification strategy based on real-time conditions. When substrates are detected at downstream apparatuses or when swapping operations are identified, the system adaptively triggers additional ID readings to maintain tracing accuracy while preserving overall production efficiency under normal operating conditions.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS10701851B2Method of mounting a component on a circuit substrate
Publication Date: 2020.06.30 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US10701851B2 patent drawing
  • US10701851B2 patent drawing
  • US10701851B2 patent drawing

AI summary

A component mounting method used in a system with a plurality of component mounting apparatuses includes reading out a substrate ID of a substrate and detecting whether the substrate is in a state of being able to be inserted or removed from one of the component mounting apparatuses. If the substrate is not in a state of being able to be inserted or removed, the substrate ID of the substrate is delivered by an upstream component mounting apparatus. If the substrate is in a state of being able to be inserted or removed the substrate ID is read in a downstream component mounting apparatus.