Substrate ID Position Detection via Optical Signal Analysis
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Solution Overview
Problem
The manual observation of ID figure positions on substrates during the manufacture of thin film field-effect transistors leads to deviations and errors, potentially causing production accidents and reducing work efficiency.
Innovation Solution
A detection device comprising a light source, image information acquisition unit, CCD, light splitter, and analyzer is used to automatically detect the position of ID figures by analyzing the difference between peak values of wave crests in electrical signals, determining if the position is abnormal based on a preset threshold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual sampling inspection is used to check ID position, then device complexity is reduced, but measurement precision deteriorates due to human error and deviation
Solution Approach 1:
The patent replaces the manual mechanical inspection system with an automated optical detection system. A light source illuminates the substrate, and a CCD camera captures images of the ID position. Image processing algorithms then automatically determine the ID position, eliminating human error and achieving high measurement precision without requiring complex manual measurement tools
Solution Approach 2:
The patent creates an optical copy (image) of the substrate and ID position using a CCD camera. This digital copy allows for precise automated analysis of the ID position through image processing, replacing the need for direct manual measurement while maintaining high accuracy
2Productivity
If manual observation is used to detect ID figure position, then ease of operation is maintained, but productivity deteriorates due to time-consuming inspection
Solution Approach 1:
The detection system performs self-service by automatically capturing images, processing them, and determining ID positions without human intervention. The system includes a light source for illumination, a CCD camera for image capture, and image processing unit that automatically analyzes the images to determine ID position, enabling continuous high-speed inspection that improves productivity
Solution Approach 2:
The patent implements continuous automated inspection where the light source continuously illuminates the substrate, the CCD camera continuously captures images, and the image processing unit continuously analyzes positions. This continuous automated operation eliminates the intermittent nature of manual inspection, significantly improving productivity while maintaining operational simplicity through automation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method eliminates manual errors, prevents production accidents, and improves work efficiency by accurately determining ID figure positions on substrates, ensuring consistent product line operations.
Implementation Method 1
transmitting, by the first image information acquisition unit, the first light signal received from the light source onto a substrate, and acquiring, by the first image information acquisition unit, a first image light signal generated by transmitting the first light signal onto both an edge of a first ID figure on the substrate and an edge of the substrate
Implementation Method 2
the first light splitter is configured to transmit the first image light signal to the first CCD so that the first CCD outputs a first electrical signal
Data Source
AI summary
A detection device and a detection method are disclosed in the embodiments. The detection device comprises a light source, a first image information acquisition unit, a first charge coupled device (CCD), a first light splitter, and a first analyzer. The first image information acquisition unit is configured to receive a first light signal from the light source and transmit the first light signal onto a substrate, and to acquire a first image light signal generated by transmitting the first light signal onto both an edge of a first ID figure on the substrate and an edge of the substrate, and transmit the first image light signal to the first light splitter; the first light splitter is configured to transmit the first image light signal to the first CCD so that the first CCD outputs a first electrical signal; and the first analyzer is configured to receive the first electrical signal outputted from the first CCD and analyze wave crests of the first electrical signal, thereby obtaining a distance between the edge of the first ID figure on the substrate and the edge of the substrate. The detection part and detection method are used for substrate detection.