Substrate Treatment Condition Setting Using Image-Based Deviation Correction
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Solution Overview
Problem
The existing methods for setting treatment conditions in substrate treatment systems, such as photolithography processes for semiconductor manufacturing, are time-consuming and costly due to the need for precise measurements using expensive equipment like scanning electron microscopes (SEM).
Innovation Solution
A method that utilizes an imaging apparatus to capture images of reference and treated substrates, calculates the deviation in color information, and applies a correlation model to determine the necessary corrections for setting the treatment conditions, allowing for efficient and cost-effective adjustments across multiple treatment apparatuses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If SEM is used to measure line width for setting treatment temperature in each region, then measurement precision is improved, but loss of time increases and device cost increases
Solution Approach 1:
The patent uses an imaging apparatus to capture images of the substrate surface, creating visual copies that can be analyzed to determine line width. This replaces the need for direct physical measurement by SEM, significantly reducing measurement time while maintaining adequate precision for process control
Solution Approach 2:
The patent employs an imaging apparatus (camera) instead of expensive SEM equipment for routine measurements. This cheaper device is sufficient for the intended purpose of monitoring line width variations across different regions, eliminating the need for costly SEM usage while achieving the required measurement capability
2Productivity
If multiple thermal treatment apparatuses are installed to increase productivity, then productivity is improved, but loss of time increases due to repeated measurements for each apparatus
Solution Approach 1:
The patent establishes a universal imaging-based measurement method that can be applied to multiple thermal treatment apparatuses using the same imaging apparatus. The method captures images and analyzes line width variations in a standardized way across all apparatuses, eliminating the need for separate measurement procedures for each device and reducing the cumulative time required for setting multiple apparatuses
3Measurement precision
If cross section SEM is used to measure film thickness for setting treatment rotation speed, then measurement precision is improved, but device cost increases and ease of manufacture deteriorates due to wafer breaking
Solution Approach 1:
The patent uses an imaging apparatus to capture surface images that provide information about film thickness without requiring physical sectioning. The imaging process creates visual records from which film thickness can be estimated, eliminating the need for destructive cross-section preparation and wafer breaking while maintaining sufficient measurement accuracy for process control
Solution Approach 2:
The patent replaces expensive cross-section SEM analysis with a simpler, cheaper imaging apparatus that can perform film thickness measurement from surface images. This eliminates the need for complex sample preparation and destructive testing, significantly improving ease of manufacture and reducing device cost while maintaining adequate measurement precision
Data Source
AI summary
This method includes, in a substrate treatment system, acquiring an image of a reference substrate which is a reference for condition setting; and acquiring an image of a treated substrate on which the predetermined treatment has been performed under a first treatment condition. A deviation amount in information between the image of the treated substrate and the image of the reference substrate is calculated. A correction amount of the treatment condition is calculated based on a correlation model indicating a correlation between a change amount in the information in the image of the treated substrate and a change amount in the treatment condition and on the deviation amount in the information. Also included is a setting of a second treatment condition based on the correction amount and a performing of the treatment on a target substrate based on the set second treatment condition.