Substrate Image Correction for Warpage Deformation

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Solution Overview

Problem

Existing substrate processing systems face challenges in accurately evaluating the processing state of substrates due to deformation issues such as warpage and uneven surfaces, which affect image quality and precision in substrate inspection.

Innovation Solution

An information processing method that involves obtaining a deformation factor of the substrate's surface, calculating a correction coefficient based on this factor, and generating a corrected image to account for surface deformation, thereby improving image accuracy and evaluation precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If substrate inspection is performed using captured images, then processing state evaluation can be conducted, but image accuracy deteriorates due to surface deformation such as warpage and uneven surfaces

Engineering Contradiction:
Improveimage accuracyVSAvoidsurface deformation
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The system performs preliminary action by capturing images of the substrate at multiple positions before final evaluation, and pre-calculates deformation factors based on these preliminary images. This allows the system to establish a deformation model in advance that can be used to correct the final inspection images, thereby compensating for surface deformation effects before they degrade measurement precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements feedback by using captured images to calculate deformation factors, then using these deformation factors to generate corrected images, and finally using the corrected images for accurate processing state evaluation. The deformation calculation results feed back into the image correction process, creating a closed-loop system that continuously improves measurement accuracy by compensating for surface deformation effects.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If surface deformation is present, then substrate processing may be affected, but image quality deteriorates leading to reduced evaluation precision

Engineering Contradiction:
Improveevaluation precisionVSAvoidimage quality
Core Design Contradiction:
Manufacturing precisionVSLoss of information

Solution Approach 1:

The system introduces an intermediary element - the deformation factor - that mediates between the physical surface deformation and the image quality degradation. By calculating deformation factors from captured images and using these factors to generate corrected images, the system creates an intermediate representation that compensates for the information loss caused by surface deformation, thereby preserving evaluation precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system creates a corrected copy of the original image by applying deformation compensation. Instead of directly using the degraded captured image for evaluation, the system generates a corrected image copy that has been adjusted to account for surface deformation effects, thereby recovering the lost information and maintaining manufacturing precision in the evaluation process.

Inventive Principle:
Principle #26Copying

Data Source

PatentUS11636579B2Information processing method, information processing apparatus and computer-readable recording medium
Publication Date: 2023.04.25 TOKYO ELECTRON LTD
  • US11636579B2 patent drawing
  • US11636579B2 patent drawing
  • US11636579B2 patent drawing

AI summary

An information processing method includes obtaining information on a deformation factor of a surface of a target substrate; obtaining a surface image of the target substrate; calculating a correction coefficient for correcting an image change due to deformation of the surface, based on the information on the deformation factor of the surface; and generating a corrected image of the target substrate by correcting the surface image of the target substrate using the correction coefficient.