Substrate Backside Imaging for Adaptive Brush Cleaning
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Solution Overview
Problem
Existing substrate processing systems face challenges in effectively addressing defocus issues during exposure processes due to foreign substances on the back surface of substrates, which are not adequately addressed by conventional brush cleaning methods.
Innovation Solution
A substrate processing apparatus and method that includes a container loading/unloading section, brush processing section, substrate reversal section, and imaging section, with a controller to determine substrate quality based on pre- and post-processing imaging, and adjust processing conditions accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If brush processing is performed to remove foreign substances from the back surface of substrates, then cleaning effectiveness is improved, but there is a risk of introducing new defects or causing damage to the substrate
Solution Approach 1:
The system performs pre-processing imaging to detect foreign substances on the back surface before brush processing. By identifying the location and characteristics of contaminants in advance, the brush processing can be针对性地 applied, removing foreign substances effectively while avoiding unnecessary processing that might introduce defects or damage to clean areas of the substrate.
Solution Approach 2:
The system performs post-processing imaging to inspect the back surface after brush processing and uses this information to determine whether substrates are good products. This feedback mechanism allows the system to verify cleaning effectiveness and detect any defects introduced during processing, enabling quality control and process optimization to prevent defect introduction.
2Manufacturing precision
If substrates are flipped and imaged before and after brush processing, then processing quality is improved, but processing time increases
Solution Approach 1:
The system performs pre-processing imaging to detect foreign substances on the back surface before brush processing. By identifying the location and characteristics of contaminants in advance, the brush processing can be针对性地 applied, removing foreign substances effectively while avoiding unnecessary processing that might introduce defects or damage to clean areas of the substrate.
Solution Approach 2:
The system performs post-processing imaging to inspect the back surface after brush processing and uses this information to determine whether substrates are good products. This feedback mechanism allows the system to verify cleaning effectiveness and detect any defects introduced during processing, enabling quality control and process optimization to prevent defect introduction.
3Reliability
If process conditions are adjusted based on imaging results, then cleaning effectiveness is improved, but system complexity increases
Solution Approach 1:
The controller determines whether substrates are good products based on post-processing imaging results and adjusts process conditions for subsequent substrates based on imaging data. This feedback mechanism enables dynamic optimization of brush processing parameters (such as brush pressure, rotation speed, or processing time) based on actual substrate conditions, improving cleaning effectiveness while maintaining a relatively simple system architecture through software-based control.
Solution Approach 2:
The system uses its own imaging capability to detect substrate conditions and automatically adjusts processing parameters without requiring external intervention. The controller autonomously determines quality based on imaging results and modifies process conditions accordingly, enabling the system to self-optimize its performance based on real-time feedback from its own inspection system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the effectiveness of brush cleaning by ensuring proper substrate processing conditions, reducing the likelihood of defective products, and improving yield by identifying and addressing defects through real-time imaging and adaptive processing adjustments.
Implementation Method 1
a brush processing section configured to perform brush processing for polishing or removing foreign substances on the second surface of each of the substrates by using a brush
Implementation Method 2
a brush processing section configured to perform brush processing for polishing or removing foreign substances on the second surface of each of the substrates by using a brush
Data Source
AI summary
A substrate processing apparatus includes: a brush processing section configured to perform brush processing on a surface of a substrate taken out from a container; a substrate reversal section configured to flip the substrate before the brush processing and after the brush processing; a substrate imaging section configured to perform pre-processing imaging on the surface before the brush processing, and perform post-processing imaging on the surface after the brush processing and before the substrate is returned to the container; and a controller, wherein the controller determines whether or not the substrate after the brush processing is a good product based on a result of the post-processing imaging, and changes, as necessary, a process condition of the brush processing for the substrate having been subjected to the pre-processing imaging or a substrate to be processed afterward based on at least one of the pre-processing imaging or the post-processing imaging.