Substrate Treatment Imaging for Nozzle Abnormality Detection

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Solution Overview

Problem

Current substrate treating apparatuses face challenges in accurately detecting abnormalities due to environmental changes, light source variations, and the presence of water droplets or fumes, leading to incorrect positional information and false detection of nozzle or component abnormalities.

Innovation Solution

A substrate treating apparatus that utilizes a design information memory unit to store three-dimensional design information, an imaging unit to capture real images, and a matching processing unit to determine the coincidence of feature points between real and design shapes, allowing for accurate abnormality detection by comparing reality information with normal information based on three-dimensional design data, even in the presence of environmental differences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Difficulty of detecting and measuring

If image-based nozzle position detection is used, then visual monitoring capability is improved, but measurement precision deteriorates due to environmental changes, light source variations, and water droplets/fumes

Engineering Contradiction:
Improvenozzle position detection capabilityVSAvoidnozzle position information accuracy
Core Design Contradiction:
Difficulty of detecting and measuringVSMeasurement precision

Solution Approach 1:

The patent creates a two-dimensional design shape as a precise copy of the three-dimensional nozzle structure. This digital model serves as a reference template that can be compared against captured images without being affected by environmental conditions, light variations, or contamination in the treatment chamber.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent transforms the three-dimensional nozzle design information into a two-dimensional design shape that corresponds to the imaging plane. This dimensional transformation allows direct comparison between the design model and captured images, enabling accurate position detection despite environmental interference.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If three-dimensional design information is used for matching, then manufacturing precision is improved, but device complexity increases due to additional processing units and data structures

Engineering Contradiction:
Improvecomponent abnormality detection accuracyVSAvoidmatching processing unit complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts only the essential two-dimensional projection of the three-dimensional nozzle design that is needed for image matching. By taking out only the relevant geometric features and creating a simplified two-dimensional design shape, the system reduces computational complexity while maintaining detection accuracy.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent segments the complex three-dimensional design information into manageable components, creating a two-dimensional design shape that focuses only on the critical features visible in the imaging plane. This segmentation simplifies the matching process by comparing only essential geometric characteristics.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP4227983B1Substrate treating apparatus, substrate treating system, and substrate treating method
Publication Date: 2024.11.20 SCREEN HOLDINGS CO LTD
  • EP4227983B1 patent drawingFigure 1
  • EP4227983B1 patent drawingFigure 2
  • EP4227983B1 patent drawingFigure 3

AI summary

Disclosed is a substrate treating apparatus for performing a predetermined treatment on a substrate. The apparatus includes a design information memory unit configured to store three-dimensional design information, an imaging unit configured to capture a real image containing the target components, a matching processing unit configured to determine which of the target components matches a real image shape as a two-dimensional shape in the real image captured by the imaging unit in accordance with a degree of coincidence of feature points between the real image shape and a two-dimensional design shape based on three-dimensional design information about the target components, and an abnormality detecting unit configured to detect an abnormality of the target component through comparison between the reality information about the matched target component based on the real image and the normal information based on the three-dimensional design information when the target component is normal.