Imaging Calibration of Substrate Placement in Process Chambers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for calibrating substrate positioning in semiconductor process chambers are inaccurate and resource-intensive, often relying on image processing that requires high computational power and can be time-consuming, with additional inaccuracies from light dispersion and movement, and pose safety and integration challenges with laser-based systems.
Innovation Solution
A method and system using a calibrating substrate with marking features detectable by an imaging apparatus to determine the center of the substrate and substrate support, allowing for precise placement and correction, reducing the need for complex image processing and avoiding the limitations of laser-based systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing image processing methods are used to detect substrate edge and determine center position, then center positioning can be achieved, but high computational power and time are required
Solution Approach 1:
The patent applies preliminary action by pre-positioning the calibrating substrate with known marking features at specific locations before the imaging process. The marking features are predetermined and placed at known positions, allowing the system to calculate center position directly from these pre-established references rather than performing complex edge detection and mathematical center calculation during operation. This reduces computational requirements and calibration time.
2Measurement precision
If existing image processing methods are used to detect substrate edge and determine center position, then center positioning can be achieved, but high computational power is required
Solution Approach 1:
The patent applies preliminary action by pre-positioning the calibrating substrate with known marking features at specific locations before the imaging process. The marking features are predetermined and placed at known positions, allowing the system to calculate center position directly from these pre-established references rather than performing complex edge detection and mathematical center calculation during operation. This reduces computational requirements and calibration time.
3Measurement precision
If light source and image processing are used to detect substrate position, then center can be determined, but light dispersion causes distorted images and inaccuracies
Solution Approach 1:
The patent applies the intermediary principle by introducing a calibrating substrate with high-contrast marking features as a mediator between the light source and the measurement process. These marking features serve as reference points that are easily detectable by the imaging apparatus, providing stable reference positions that are not affected by light dispersion issues. The known positions of these markings allow accurate center determination without relying on edge detection that is susceptible to optical distortion.
4Measurement precision
If laser-based systems are used to detect substrate edge by reflectance or dispersion, then edge detection is improved, but safety concerns and high cost arise
Solution Approach 1:
The patent applies the cheap short-living objects principle by using a calibrating substrate with marking features that can be easily manufactured and replaced. Instead of using expensive laser-based systems, the invention employs simple imaging apparatus with a calibrated substrate that has predetermined marking features. This approach significantly reduces cost while maintaining measurement accuracy, and the calibrating substrate can be easily replaced if needed without requiring complex laser safety infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and accurate calibration of substrate positioning, improving process uniformity by reducing temperature gradients and enhancing precision without the safety and integration issues of laser-based systems.
Implementation Method 1
capturing one or more images of the calibrating substrate and the substrate support using the imaging apparatus. The one or more images show the plurality of marking features on the calibrating substrate relative to one or more predefined features on the substrate support
Data Source
AI summary
An apparatus, method, and system for calibrating substrate positioning and placement on a substrate support in a process chamber via imaging. In an embodiment, a calibrating substrate is provided. The calibrating substrate generally includes a top surface having a plurality of first marking features and a at least one edge marking feature configured to be detectable relative to the remaining portions of the top surface of the body by an imaging apparatus.