Electronic Component Storage Substrate with Inclined Corners
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Solution Overview
Problem
Conventional electronic component storage substrates face challenges in miniaturization, leading to reduced mechanical strength and increased likelihood of cracks at corner portions due to thermal stress from seam welding, as the bonding surface area between the lid and metal layer is large, making the metal layer susceptible to contractive forces.
Innovation Solution
The electronic component storage substrate features a rectangular frame-shaped substrate bank section with inclined corner portions, reducing the bonding surface area and mitigating thermal stress by tapering the metal layer thickness from the inner to the outer surface, thereby preventing breakage and enhancing seal effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding surface area between the lid and metal layer is increased to improve sealing effectiveness, then the seal effectiveness is improved, but the metal layer becomes more susceptible to contractive forces from seam welding, increasing the likelihood of cracks
Solution Approach 1:
The patent applies local quality by creating a metal layer with non-uniform thickness distribution. The metal layer is thicker at the inner surface of the substrate bank section and thinner at the outer surface, allowing different regions to serve different functions: the thicker inner region provides bonding area for sealing while the thinner outer region reduces susceptibility to weld-induced contractive forces and crack formation.
2Volume of moving object
If electronic components and storage substrates are miniaturized to meet size requirements of modern electronic devices, then the device size is reduced, but the mechanical strength of the substrate bank section is reduced, increasing the likelihood of cracks
Solution Approach 1:
The patent applies parameter changes by modifying the thickness parameter of the metal layer. Instead of maintaining uniform thickness, the metal layer thickness is varied across different locations, being thicker at the inner surface and thinner at the outer surface. This parameter variation allows the substrate to maintain adequate strength despite miniaturization while still providing sufficient bonding area for sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the occurrence of cracks and improves the airtightness of the electronic component housing package by distributing thermal stress more evenly, ensuring the reliability and performance of small-sized electronic components.
Implementation Method 1
thermal stress from seam welding, as the bonding surface area between the lid and metal layer is large, making the metal layer susceptible to contractive forces
Implementation Method 2
a bonding method such as seam welding, for instance, may be used to join the lid 113 and the metal layer 111
Data Source
AI summary
The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.