Light-Emitting Substrate Ink Curing to Prevent White Ink Peeling
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Solution Overview
Problem
The white ink layer on active sub-millimeter light-emitting diode displays is prone to peeling, leading to interfacial corrosion due to insufficient curing and undercut structures.
Innovation Solution
A manufacturing method involving irradiation of the ink layer outside a defined area with a first preset wavelength of light while heating from the opposite side, improving reactivity and preventing peeling by ensuring sufficient curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the ink layer is applied to cover the conductive pad and substrate, then the substrate gains scratch resistance and protection, but the ink layer becomes prone to peeling due to insufficient curing and undercut structures
Solution Approach 1:
The patent applies preliminary heating to the ink layer before light irradiation to activate the curing reaction. By pre-heating the ink layer to a temperature that activates the curing agent, the subsequent light irradiation can effectively cure the ink layer without causing undercut structures, thereby preventing peeling while maintaining scratch resistance
Solution Approach 2:
The patent changes the temperature parameter of the ink layer by applying heat before light irradiation. This temperature change activates the curing agent in the ink layer, enabling proper curing and adhesion to the conductive pad, thus resolving the peeling issue while preserving the protective function
2Manufacturing precision
If light irradiation is applied to cure the ink layer, then the ink layer achieves proper curing, but areas far from the light source remain insufficiently cured causing undercut issues
Solution Approach 1:
The patent applies preliminary heating to the entire ink layer before light irradiation. This pre-heating activates the curing agent throughout the ink layer, ensuring that even areas far from the light source can cure properly when exposed to light, thereby preventing undercut structures and ensuring complete curing
Solution Approach 2:
The patent introduces heat as an intermediary to activate the curing agent in the ink layer. This heat activation serves as a mediator that enables the light irradiation to effectively cure the entire ink layer uniformly, including distant areas, thus preventing incomplete curing and undercut formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents ink layer peeling by enhancing the reactivity of the ink layer outside the defined area, thus addressing the undercut issue and ensuring the ink layer adheres properly to the substrate.
Implementation Method 1
irradiating the ink layer outside the preset area from a first side by light with a first preset wavelength
Implementation Method 2
heating the ink layer outside the preset area from a second side
Data Source
AI summary
A light-emitting substrate and a manufacturing method thereof are provided. The reactivity of part of the ink layer outside the preset area that is far from the light with the first preset wavelength is improved by a heating process. Thus, the part of the ink layer reacts sufficiently under irradiation of the light with the first preset wavelength at lower energy. This improves an undercut issue caused by insufficient curing of the ink layer outside the preset area far from the light with the first preset wavelength, thereby preventing the ink layer from being peeled off from the light-emitting substrate.