Substrate Inspection Device for Adhesive and Solder Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate inspection devices fail to reliably inspect the application quality of adhesives and printing quality of solder paste, leading to incorrect mounting positions of electronic components due to insufficient self-alignment effects caused by mismatched curing and melting temperatures.
Innovation Solution
A substrate inspection device that irradiates solder and adhesive with light, generates actual and ideal position information using imaging, and outputs positional misalignment data to adjust mounting positions, ensuring accurate alignment and inspection based on design and manufacturing data, with the adhesive's curing temperature set higher than the solder's melting temperature to enhance self-alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive curing temperature is lower than the solder paste melting temperature, then the adhesive cures prior to solder fusion, but the self-alignment effect is insufficient causing incorrect mounting positions
Solution Approach 1:
The patent changes the temperature parameter relationship by setting the adhesive curing temperature higher than the solder paste melting temperature, which reverses the conventional sequence and enables the self-alignment effect to occur properly, thereby improving mounting position accuracy
Solution Approach 2:
The solder paste is allowed to melt and perform self-alignment before the adhesive fully cures, creating a preliminary action sequence where the solder establishes proper positioning that the adhesive then maintains
2Reliability
If the adhesive curing temperature is higher than the solder paste melting temperature, then the self-alignment effect is exerted, but inspection based on offset reference position fails to accurately inspect adhesive application quality
Solution Approach 1:
The patent segments the inspection process into two distinct parts: solder paste inspection using offset reference positions and adhesive inspection using non-offset reference positions, allowing each material to be inspected with the appropriate reference system for its properties
Solution Approach 2:
Different inspection methods are applied to different materials based on their local properties: solder paste inspection uses offset reference positions to account for self-alignment, while adhesive inspection uses non-offset reference positions since adhesive does not undergo self-alignment
3Measurement precision
If inspection uses offset reference position for solder paste, then mounting position information is improved, but adhesive application quality inspection becomes unreliable
Solution Approach 1:
The inspection system is segmented to apply different reference position strategies: offset reference positions for solder paste to capture self-alignment effects, and non-offset reference positions for adhesive to accurately reflect its application quality without the self-alignment variable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reliably mounts electronic components at appropriate positions, improves manufacturing efficiency, and accurately inspects adhesive and solder quality, preventing defective soldering and reducing manufacturing costs by accounting for self-alignment effects during the inspection and mounting processes.
Implementation Method 1
an irradiation unit configured to irradiate at least the solder and the adhesive with light
Implementation Method 2
an imaging unit configured to take an image of at least the solder and the adhesive irradiated with the light
Implementation Method 3
the adhesive has a curing temperature that is set to be higher than a melting temperature of the solder
Implementation Method 4
the self-alignment effect is achieved by the function that causes the solder paste molten in the reflow process to wet and spread along the surface of the electrode pattern
Implementation Method 5
causes the solder paste molten in the reflow process to wet and spread along the surface of the electrode pattern
Data Source
AI summary
A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.