Substrate Inspection Device Dynamic Grouping
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Solution Overview
Problem
Current substrate inspection methods face challenges in accurately detecting defects due to varying states of inspection target wafers, which can lead to pseudo defects and require a large number of reference images, increasing startup effort and complexity.
Innovation Solution
A substrate inspection device and method that dynamically defines groups based on the basic state of wafers, using a setting part to determine group membership and create inspection recipes, allowing for accurate defect inspection without pre-prepared reference images by matching process and image-based features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple reference images are prepared for different wafer states, then defect inspection accuracy is improved, but startup effort and system complexity increase
Solution Approach 1:
The system automatically determines wafer groups and creates inspection recipes without requiring manual preparation of reference images for each wafer state. The determination part autonomously analyzes wafer images and processes to identify group memberships, eliminating the need for operators to pre-prepare multiple reference image sets for different wafer conditions.
Solution Approach 2:
The system dynamically adjusts inspection parameters by creating different inspection recipes for different wafer groups. Instead of using fixed reference images, the system changes inspection parameters based on the determined group characteristics, allowing accurate defect inspection adapted to each wafer's specific state without manual intervention.
2Measurement precision
If multiple reference images are prepared for different wafer states, then defect inspection accuracy is improved, but the number of required reference images increases
Solution Approach 1:
The system automatically determines wafer groups and creates inspection recipes without requiring manual preparation of reference images for each wafer state. The determination part autonomously analyzes wafer images and processes to identify group memberships, eliminating the need for operators to pre-prepare multiple reference image sets for different wafer conditions.
Solution Approach 2:
A single dynamic group determination mechanism serves multiple wafer states and inspection scenarios. Instead of requiring separate reference images for each wafer state, the system uses one universal group determination process that adapts to different wafer conditions by creating appropriate inspection recipes on-the-fly.
3Measurement precision
If manual group setting is performed for each wafer type, then inspection accuracy is improved, but processing time and productivity decrease
Solution Approach 1:
The determination part automatically performs group determination by analyzing wafer images and process information without requiring manual operator intervention. The system self-services by autonomously identifying wafer groups and creating corresponding inspection recipes, eliminating the time-consuming manual grouping process while maintaining accurate inspection.
Solution Approach 2:
The system performs group determination and inspection recipe creation as preliminary automated actions before the actual defect inspection process. By pre-establishing wafer groups and their corresponding recipes through automatic analysis, the system prepares inspection parameters in advance without manual intervention, enabling fast and accurate inspection execution.
Data Source
AI summary
A substrate inspection device for inspecting a substrate, includes: a setting part configured to define a group according to a basic state that is not dependent on a presence or absence of a defect in a substrate and set the defined group for each inspection target substrate; an inspection part configured to perform a defect inspection based on a captured image of the inspection target substrate and an inspection recipe corresponding to the defined group to which the inspection target substrate belongs and including a reference image; a recipe creation part configured to create the inspection recipe for each group; and a determination part configured to perform a determination as to whether a group-setting target substrate, for which the group is set by the setting part, belongs to the group defined by the setting part.