Substrate Inspection Height Data Tilt Compensation
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Solution Overview
Problem
Existing methods for inspecting substrates with electronic devices face challenges in obtaining reliable height data due to noise, tilt, and shadow effects, leading to reduced accuracy and reliability in integrated measurement results.
Innovation Solution
A method that compensates for tilt in measurement data from multiple projecting parts by selecting a reference area with high reliability, excluding noise areas, and modifying height data to improve the accuracy and reliability of integrated height data, using techniques such as visibility and gray scale information to set up noise areas and adjust phase data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple projecting parts are used to measure height data, then measurement coverage is improved, but reliability of integrated height data deteriorates due to tilt and noise
Solution Approach 1:
The patent divides the measurement area into multiple effective areas, each corresponding to a specific projecting part. By segmenting the measurement process and data processing, the system can handle tilt and noise from individual projecting parts independently, then integrate the results to achieve both wide coverage and high reliability.
Solution Approach 2:
The patent introduces effective area determination as an intermediary step between raw measurement and integrated results. This intermediary process identifies and excludes noise areas, and compensates for tilt effects, thereby mediating between the multiple projecting parts' data and the final integrated height data to improve reliability.
2Quantity of substance
If noise data is included in measurement, then data completeness is improved, but measurement precision deteriorates
Solution Approach 1:
The patent extracts and identifies effective areas from the total measurement data by analyzing phase data and height information. This extraction process separates useful measurement data from noise data, allowing the system to maintain data completeness while improving measurement precision by excluding identified noise areas from the final integrated results.
3Area of stationary object
If shadow areas are included in measurement, then measurement coverage is improved, but reliability of height measurement deteriorates
Solution Approach 1:
The patent converts the harmful shadow effect into a useful indicator by using the presence of shadows to identify effective areas. Instead of treating shadow areas as complete measurement failures, the system uses shadow information to determine which areas have sufficient ground reference information, thereby converting a measurement limitation into a criterion for reliable measurement identification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and accuracy of integrated height data by compensating for tilt and noise, resulting in more precise inspection results by isolating noise areas and using reliable reference points for data integration.
Implementation Method 1
a light source and a grating to project pattern light onto the target object
Implementation Method 2
a light source and a grating to project pattern light onto the target object
Data Source
AI summary
A method of inspecting a substrate is disclosed. The method of inspecting a substrate, comprises: obtaining phase data per projecting part with regard to a substrate, by projecting pattern beam onto the substrate having a target object formed thereon through a plurality of projecting parts in sequence; obtaining height data per projecting part with regard to the substrate by using the phase data per the projecting part; compensating tilt of the height data by using the height data per projecting part; modifying the tilt-compensated height data per projecting part; and obtaining integrated height data by using the modified height data.