Rear-Surface Substrate Inspection Using Fork Locus Image Correction
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Solution Overview
Problem
Existing substrate inspection methods struggle to accurately detect abnormalities on the rear surface of substrates during high-speed transportation due to image blurring caused by the movement of the substrate, making it difficult to specify the size and position of defects.
Innovation Solution
A substrate inspection method that uses a line camera to capture images of the rear surface of a substrate while being transported, generates a corrected image based on the locus information of the fork, and specifies feature information such as abnormal portions using machine learning or image processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate transportation speed is increased to improve productivity, then throughput is improved, but image blurring occurs making abnormality detection precision deteriorate
Solution Approach 1:
The patent applies preliminary action by capturing the locus information of the fork during substrate transportation before image processing. This pre-captured motion data is then used to correct the captured images, allowing high-speed transportation while maintaining image quality for accurate abnormality detection.
Solution Approach 2:
The patent changes the parameter of image processing by applying correction based on fork locus information. The correction process adjusts the captured images using the pre-captured motion parameters, transforming blurred high-speed images into corrected images suitable for accurate abnormality detection.
2Productivity
If line camera is used to capture images during high-speed transportation, then productivity is improved, but image quality deteriorates due to motion blur
Solution Approach 1:
The patent introduces an intermediary element - the fork locus information - that mediates between the high-speed transportation and image capture. This intermediary data serves as a bridge to correct the motion-induced blur, allowing the system to maintain both high inspection speed and high image quality.
Solution Approach 2:
The patent applies parameter changes by using the captured fork locus information to transform the image capture parameters. The correction process adjusts timing and positioning parameters based on the fork's actual motion, converting blurred images into high-quality corrected images suitable for precise inspection.
3Loss of time
If substrate is transported quickly to reduce inspection time, then loss of time is reduced, but measurement precision of defect position deteriorates
Solution Approach 1:
The patent applies preliminary action by capturing the fork's locus information during the quick substrate transportation. This pre-captured motion data enables subsequent precise correction of the captured images, allowing rapid inspection while maintaining accurate defect position measurement through the correction process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate detection of abnormalities on the substrate surface even at high speeds, improving throughput and space efficiency by correcting image blurring, allowing for precise identification of defect sizes and positions.
Implementation Method 1
capturing, while transporting a substrate with a fork, an image of a rear surface of the substrate using a line camera
Data Source
AI summary
A substrate inspection method includes: capturing, while transporting a substrate with a fork, an image of a rear surface of the substrate using a line camera in which light receiving elements are arranged in a width direction orthogonal to a transport direction of the substrate; generating a corrected image by correcting the image captured in the capturing the image based on locus information of the fork when the substrate is being transported; and specifying feature information including a position of an abnormal portion existing on the rear surface of the substrate based on the corrected image.