Light-Emitting Substrate Insulation Layout for Corrosion Resistance

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Solution Overview

Problem

Existing display devices face issues with electrochemical corrosion and short circuits due to water vapor ingress through organic insulating layers, leading to reliability concerns, especially in the overlapping regions of conductive layers.

Innovation Solution

A light-emitting substrate design featuring a narrow organic insulator only in the overlapping region between conductive layers, avoiding the via positions of light-emitting elements, and using a cover layer with non-overlapping openings to prevent water vapor contact, thereby reducing electrochemical corrosion and short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a wide organic insulating layer is used to cover the entire substrate, then manufacturing is easier and coverage is complete, but water vapor absorption increases leading to electrochemical corrosion and short circuits

Engineering Contradiction:
Improveelectrochemical corrosion resistanceVSAvoidorganic material absorption
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The organic insulating layer is selectively applied only in the overlapping region between the first and second conductors, rather than covering the entire substrate. This localized approach reduces the total amount of organic material while maintaining insulation where it is most needed to prevent electrochemical corrosion between adjacent conductors.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The insulating structure is segmented into multiple components: an inorganic insulating layer providing baseline insulation, and a targeted organic insulating layer filling gaps only in the critical overlapping region. This segmentation allows each material to be used where it provides the most benefit, reducing overall organic material content while maintaining reliability.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the organic insulating layer is reduced to only the overlapping region, then water absorption is minimized, but manufacturing precision requirements increase

Engineering Contradiction:
Improveshort circuit preventionVSAvoidinsulator positioning accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The inorganic insulating layer serves as an intermediary baseline structure that provides initial insulation and positioning reference. The organic insulating layer is then selectively added on top of this inorganic layer only where needed in the overlapping region, using the inorganic layer as a guide to reduce positioning precision requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The inorganic insulating layer is formed first as a preliminary insulating structure that defines the basic insulation framework. This preliminary action establishes reference points and reduces the complexity of subsequently positioning the organic insulating layer with high precision.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If conductors are positioned closer together to increase pixel density, then display resolution improves, but the risk of electrochemical corrosion between conductors increases

Engineering Contradiction:
Improvepixel densityVSAvoidconductor isolation
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

A composite insulating structure combining inorganic and organic insulating layers is used to provide enhanced isolation between closely spaced conductors. The inorganic layer provides baseline insulation while the organic layer fills gaps and provides additional protection in the overlapping region, enabling closer conductor spacing without increasing corrosion risk.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

Enhanced insulating protection is applied locally only in the overlapping region where electrochemical corrosion is most likely to occur between closely spaced conductors. This localized enhancement allows conductors to be positioned closer together while maintaining reliable isolation where it is most needed.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12520641B2Light-emitting substrate, method for manufacturing the same, and display device
Publication Date: 2026.01.06 HEFEI BOE RUISHENG TECH CO LTD
  • US12520641B2 patent drawing
  • US12520641B2 patent drawing
  • US12520641B2 patent drawing

AI summary

The present disclosure provides a light-emitting substrate, a method for manufacturing the same, and a display device. The light-emitting substrate includes: a substrate including a light-emitting region; a first conductor on the substrate and at least in the light-emitting region, the first conductor extending along a first direction in the light-emitting region; a second conductor on the first conductor and arranged in the light-emitting region, the second conductor including a first connecting portion; and a first insulator within the light-emitting region. The first connecting portion extends along a second direction, an orthographic projection of the first connecting portion on the substrate at least partially overlaps with an orthographic projection of the first conductor on the substrate to constitute an overlapping region. The first insulator is only between the first connecting portion and the first conductor, the overlapping region is within an orthographic projection of the first insulator on the substrate.