Substrate With Built-In Components Using Insulator Openings
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Solution Overview
Problem
Substrates with built-in electronic components often experience deformation such as warping or distortion due to significant differences in rigidity between regions of low and high rigidity, especially as the substrate thickness decreases.
Innovation Solution
Incorporating insulator-filled openings in regions of high rigidity within the core layer to reduce the rigidity difference between housing portions and non-housing portions, thereby minimizing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are inserted in penetrating holes scattered throughout the core substrate, then the substrate can accommodate multiple electronic components with wiring connections, but the core substrate develops regions of low rigidity and high rigidity that cause warping or distortion
Solution Approach 1:
The patent applies local quality by forming openings specifically in regions of high rigidity (where no housing portions are formed) rather than uniformly throughout the substrate. This localized modification reduces rigidity only where needed, balancing the rigidity distribution across the substrate while preserving the structural integrity of regions containing electronic components.
Solution Approach 2:
The patent changes the physical parameter of rigidity by introducing openings filled with insulator material. This modifies the local mechanical properties of the core substrate, reducing the rigidity difference between regions with and without housing portions, thereby preventing warping and distortion.
2Length of stationary object
If the core substrate is made thinner to reduce overall substrate thickness, then the substrate becomes more compact, but the difference in rigidity between regions becomes more pronounced causing increased warping or distortion
Solution Approach 1:
By applying local quality through strategically placed openings in high-rigidity regions, the patent compensates for the reduced overall thickness. The openings locally reduce rigidity in specific areas, balancing the rigidity distribution even when the substrate is thin, thereby preventing warping without requiring increased overall thickness.
3Stability of the object's composition
If openings filled with insulator are formed in regions of high rigidity, then the rigidity difference between regions is reduced minimizing warping or distortion, but the device structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the core substrate into distinct regions: regions with housing portions containing electronic components and regions without housing portions. Openings are formed specifically in the latter regions, creating a segmented structure that addresses rigidity imbalance while maintaining a relatively simple overall design.
Solution Approach 2:
The openings filled with insulator material serve multiple functions: they reduce local rigidity to balance rigidity distribution, provides wiring pathways, and maintain structural integrity. This multi-functionality reduces the need for additional separate structures, thereby limiting the increase in device complexity.
Data Source
AI summary
Provided is a substrate with a built-in electronic component that can minimize an occurrence of a deformation such as warping or distortion of the substrate with a built-in electronic component, which is caused by a difference in rigidity between a region of low rigidity and a region of high rigidity that are formed in a core layer thereof. In the substrate with a built-in electronic component, electronic components 12 are respectively housed in a plurality of housing portions 11a1 that are formed in a core layer 11a, and in the core layer 11a, a plurality of openings 11a2 filled with an insulator 11k are formed.