Substrate Interconnection Protrusions for Cap Bonding
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Solution Overview
Problem
Conventional package modules face limitations in substrate layout flexibility due to the size of the metal ring, either having insufficient space if too wide or solder paste accumulation if too narrow, leading to reduced efficiency and space constraints.
Innovation Solution
A substrate with an interconnection layer featuring an annular portion and protrusions that increase the bonding area with a cap using solder paste, allowing for a smaller metal ring width and enhanced layout space, while maintaining strong adhesive bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the metal ring is made wide to ensure sufficient bonding area, then the bonding strength between substrate and cap is improved, but the available layout space on the substrate is reduced
Solution Approach 1:
The patent transitions from a two-dimensional planar metal ring to a three-dimensional structure by adding protrusions that extend vertically from the substrate surface. This dimensional change increases the bonding surface area without expanding the horizontal footprint, thereby maintaining layout space while enhancing bonding strength.
Solution Approach 2:
The metal ring is segmented into multiple protrusions distributed around the annular region. This segmentation allows the bonding function to be distributed across multiple discrete contact points, increasing total bonding area while maintaining a compact overall structure that preserves layout space.
2Area of stationary object
If the metal ring is made narrow to increase layout space, then the available layout space is increased, but the solder paste may be gathered in a certain area leading to insufficient bonding area
Solution Approach 1:
By extending the metal ring structure vertically through protrusions, the patent creates additional bonding surface area in the vertical dimension. This allows the horizontal metal ring to remain narrow (preserving layout space) while the vertical protrusions provide sufficient total bonding area for adequate solder paste distribution and bonding.
3Quantity of substance
If the metal ring width is increased to improve bonding area, then the bonding area is increased, but the size of the package module is increased
Solution Approach 1:
The patent achieves increased bonding area by extending structures vertically rather than horizontally. The protrusions add bonding surface area in the vertical dimension without significantly increasing the horizontal footprint of the package module, thereby maintaining compact overall dimensions while providing sufficient bonding area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances bonding strength between the substrate and cap, increases available layout space, and reduces the package module size, addressing the limitations of conventional designs.
Implementation Method 1
a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive
Data Source
AI summary
A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.