Substrate Layered Structure With Interposer Blocks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing substrate layered structures in mobile terminals face challenges in simplifying the manufacturing process, enhancing coupling force between substrates, and optimizing space utilization, particularly due to the need for complex alignment and additional plating processes that hinder antenna formation and increase costs.
Innovation Solution
A substrate layered structure comprising a first circuit board, a second circuit board, and interposer blocks with dielectric signal via holes and reinforcing pads, which allows for simplified assembly and alignment without separate jigs, reduces manufacturing costs, and enables efficient space utilization and antenna formation by omitting edge plating and underfill processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional substrate layered structure with edge plating is used, then noise shielding is improved, but manufacturing complexity and cost increase due to additional plating processes
Solution Approach 1:
The patent extracts and removes the edge plating process from the traditional substrate layered structure. By eliminating the plating layer at the edges of substrates, the manufacturing process is simplified while maintaining noise shielding through alternative means (ground vias and reinforcing pads), directly resolving the contradiction between noise shielding and manufacturing complexity
Solution Approach 2:
The patent applies local quality by concentrating noise shielding resources at critical locations rather than uniformly across the entire substrate edge. Reinforcing pads are strategically placed at specific positions where noise shielding is most needed, and ground vias are distributed to provide localized electromagnetic shielding, replacing the continuous edge plating with discrete localized shielding elements
2Manufacturing precision
If alignment jigs are used for substrate assembly, then alignment precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent implements self-service alignment through self-aligning structures integrated into the substrate design. Alignment marks and positioning features are built into the substrates themselves, allowing them to automatically align with each other during assembly without requiring external alignment jigs or specialized equipment, thereby reducing manufacturing complexity while maintaining precision
Solution Approach 2:
The patent applies preliminary action by pre-forming alignment features and positioning structures on the substrates during the substrate manufacturing process. These pre-integrated alignment features ensure precise positioning during subsequent assembly operations, eliminating the need for complex alignment equipment while maintaining high alignment precision
3Strength
If underfill process is applied, then coupling force between substrates is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent extracts and eliminates the underfill process from the manufacturing sequence. By redesigning the connection structure to rely on direct bonding between substrates and interposer blocks through signal pads and ground vias, the patent removes the need for the separate underfill step, thereby maintaining coupling strength while significantly improving manufacturing efficiency
Solution Approach 2:
The patent merges the coupling function with the signal transmission and grounding functions. The same structural elements (signal pads, ground vias, and interposer blocks) that provide electrical connectivity also provide mechanical coupling and structural support, eliminating the need for a separate underfill layer that would otherwise be required solely for mechanical bonding
Data Source
AI summary
A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.