Substrate Inverting Apparatus with Elastic Clamping and Vertical Pin Retraction
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently inverting multiple substrates simultaneously without damaging them, as existing methods may cause damage due to improper clamping or positioning errors.
Innovation Solution
A substrate inverting apparatus that includes a support mechanism for vertically stacking substrates and a clamping and inverting mechanism with elastic members to securely clamp and invert multiple substrates, along with detection parts to monitor substrate abnormalities and ensure safe inversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are inverted simultaneously using existing methods, then processing throughput is improved, but substrate damage risk increases due to improper clamping or positioning errors
Solution Approach 1:
The clamping mechanism is divided into multiple independent clamping members, each capable of independently clamping a substrate. This segmentation allows each clamping member to precisely adapt to its assigned substrate, reducing the risk of damage while enabling simultaneous inversion of multiple substrates.
Solution Approach 2:
Position detection parts are integrated to detect the position and state of each substrate before clamping. This feedback mechanism ensures that substrates are properly positioned and oriented before the clamping action, preventing positioning errors that could lead to substrate damage during simultaneous inversion.
2Reliability
If clamping members are positioned close to substrate edge for secure clamping, then clamping reliability is improved, but substrate rupture risk increases due to excessive force or positioning errors
Solution Approach 1:
Position detection parts detect and verify substrate positions before the clamping members engage. This preliminary action ensures that substrates are correctly positioned, allowing clamping members to apply force at optimal locations without risking rupture from positioning errors.
Solution Approach 2:
The clamping mechanism allows for adjustable clamping force parameters. By optimizing the clamping force to be sufficient for secure holding but not excessive, the system achieves reliable clamping without causing substrate rupture, balancing the competing requirements.
3Ease of operation
If support pin is retracted laterally to release substrate, then substrate release is achieved, but substrate damage occurs due to contact between lower surface and support pin
Solution Approach 1:
Instead of retracting the support pin laterally in the same plane as the substrate, the support pin is designed to move vertically upward. This dimensional change in the release mechanism allows the substrate to be released without lateral contact that could damage the substrate surface.
4Productivity
If clamping members approach substrate edge to clamp securely, then clamping effectiveness is improved, but substrate fall risk increases when substrate position or size deviates
Solution Approach 1:
Position detection parts continuously monitor substrate position and dimensions before and during clamping. This feedback allows the system to detect deviations in substrate position or size and adjust the clamping action accordingly, preventing substrate fall while maintaining effective clamping.
Solution Approach 2:
The clamping mechanism is designed with dynamic adjustment capabilities, allowing clamping members to adapt their position and force based on actual substrate characteristics. This dynamic response ensures secure clamping even when substrates have slight variations in position or size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables safe and efficient simultaneous inversion of multiple substrates, improving throughput by preventing damage and ensuring accurate clamping and positioning, while also reducing the load on conveyance robots and processing steps.
Implementation Method 1
an elastic member which elastically biases the clamping members arranged at the near position toward the side surface of the substrate
Data Source
AI summary
Provided is a technique which can properly invert a plurality of substrates at a time. To achieve this object, a substrate inverting apparatus includes: a support mechanism which supports a plurality of substrates in a state where the substrates are stacked vertically in a spaced-apart manner in a horizontal posture; and a clamping and inverting mechanism which clamps the plurality of substrates supported by the support mechanism respectively and inverts the plurality of substrates at a time. In the support mechanism, support members which support the substrate are moved to a standby position from a support position while being moved downward away from the center of the substrate as viewed in the vertical direction. On the other hand, in the clamping and inverting mechanism, clamping members which clamp the substrate are moved to a near position from a remote position by a clamping member drive part and are elastically biased by an elastic member toward side surfaces of the substrate at the near position.