Substrate Inverting Unit for Dual-Surface Cleaning
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Solution Overview
Problem
Current substrate processing methods for semiconductor and display devices are inefficient in cleaning both surfaces of substrates, leading to productivity issues due to the need for separate processes for the front and back surfaces.
Innovation Solution
A substrate processing apparatus and method that includes a process module with a substrate support unit, an inverting unit, and a transfer module, allowing for simultaneous processing of both surfaces within a single chamber, utilizing different cleaning units such as brushes, ultrasonic waves, and chemical solutions to efficiently clean both surfaces sequentially.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate cleaning processes are used for front and back surfaces of substrates, then cleaning thoroughness is ensured, but processing time increases and productivity decreases
Solution Approach 1:
The patent combines the cleaning of front and back surfaces into a single process module by introducing an inverting unit that flips the substrate between processing stages. This allows both surfaces to be cleaned within one chamber sequence, eliminating the need for separate process modules and reducing total processing time while maintaining cleaning thoroughness.
Solution Approach 2:
The inverting unit dynamically changes the orientation of the substrate from front-side up to back-side up during the cleaning process. This dynamic repositioning enables the same cleaning apparatus to effectively process both surfaces sequentially, improving productivity without compromising cleaning quality.
2Productivity
If multiple process modules are used for front and back surface processing, then processing capacity increases, but device complexity and space requirements increase
Solution Approach 1:
The patent merges the functionality of multiple process modules into a single module by incorporating an inverting unit. This allows one process module to handle both front and back surface cleaning operations that would traditionally require separate modules, thereby reducing overall device complexity and space requirements while maintaining processing capacity.
Solution Approach 2:
The single process module is designed with multi-functionality through the inverting unit, enabling it to perform both front-side and back-side cleaning operations. This universal design allows one module to replace multiple specialized modules, simplifying the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves productivity by allowing for faster and more efficient cleaning of both surfaces of substrates within a single process module, reducing processing time and minimizing the impact of abnormalities in one module on others.
Implementation Method 1
an inverting unit for inverting the substrate
Implementation Method 2
a first processing unit 40 for performing physical cleaning using a brush
Implementation Method 3
a second processing unit 50 for performing cleaning using ultrasonic waves
Data Source
AI summary
A substrate processing apparatus includes a process module including a substrate support unit, an inverting unit and a processing unit, and a transfer module, wherein the inverting unit inverts a substrate so that a second surface faces upward, and provides the inverted substrate to the substrate support unit, wherein the processing unit performs a first processing on the second surface of the substrate seated on the substrate support unit, wherein the inverting unit inverts the first processed substrate so that the first surface faces upward, wherein the transfer module takes the substrate with a first surface facing upward out of the process module, and introduces again the substrate with a first surface facing upward into the process module to seat it on the substrate support unit, wherein the processing unit performs a second processing on the first surface of the substrate seated on the substrate support unit.