Semiconductor Substrate Sidewall Isolation Layer
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to increased complexity in manufacturing, resulting in issues such as cracking, delamination, and high yield loss due to the development of cracks and chippings during substrate cutting, which affects the reliability and performance of semiconductor structures.
Innovation Solution
A semiconductor structure is manufactured with an isolation layer surrounding the substrate's sidewall to protect it from cracks and chippings, preventing delamination and propagation of cracks, thereby enhancing the reliability and performance of the semiconductor structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate is miniaturized to reduce device size, then the device size is reduced, but the manufacturing complexity increases and leads to cracking and chippings
Solution Approach 1:
The substrate structure is segmented into multiple functional layers including a core substrate, an isolation layer surrounding the sidewall, and a protective layer. This segmentation allows each layer to perform specific functions that collectively reduce manufacturing complexity and prevent defects during miniaturization processes.
Solution Approach 2:
The isolation layer is formed surrounding the substrate sidewall before final packaging and assembly operations. This preliminary protective structure prevents cracks and chippings from developing during subsequent manufacturing steps, addressing the complexity issue before it manifests.
2Adaptability or versatility
If manufacturing operations are increased to achieve greater functionality, then the functionality is improved, but the risk of delamination and cracking increases
Solution Approach 1:
The isolation layer acts as a cushioning protective structure formed beforehand around the substrate sidewall. This layer absorbs and distributes mechanical stresses from multiple packaging and assembly operations, preventing crack propagation and delamination while allowing increased functionality to be integrated.
Solution Approach 2:
The semiconductor structure employs a composite multi-layer configuration combining the core substrate, isolation layer, and protective layer. Each material is selected for specific mechanical and electrical properties, creating a composite structure that maintains reliability under increased manufacturing complexity and functional integration.
3Ease of manufacture
If the substrate is cut during fabrication, then the substrate can be processed and assembled, but cracks and chippings develop at the sidewall
Solution Approach 1:
The isolation layer serves as an intermediary protective structure between the substrate and the harmful effects of cutting operations. This layer is formed surrounding the sidewall before cutting, absorbing mechanical stresses and preventing cracks and chippings from developing during substrate processing and assembly operations.
4Adaptability or versatility
If manufacturing complexity increases, then greater functionality is achieved, but yield loss increases due to cracks and chippings
Solution Approach 1:
The isolation layer is formed as a protective structure before packaging and assembly operations, cushioning the substrate against mechanical stresses that cause cracks and chippings. This prevents yield loss while allowing complex multi-functional devices to be manufactured through multiple processing steps.
Data Source
AI summary
A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a sidewall substantially orthogonal to the first surface and the second surface; and a metallic layer surrounding and connected with the sidewall of the substrate, wherein the metallic layer includes an exposed surface substantially level with the first or second surface of the substrate. Further, a method of manufacturing the semiconductor structure is also disclosed.