Semiconductor Substrate Joint Damage Detection Using Stress-Emitted Light
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Solution Overview
Problem
Existing technologies fail to detect damage in the joint parts between terminals of electronic components and substrates due to thermal stress, which can lead to breakage, and require additional detection circuits for failure prediction.
Innovation Solution
A substrate design incorporating stress light emitting bodies in lands and light detection units to detect stress and damage in joint parts without additional detection circuits, using materials like zinc sulfide doped with manganese and strontium aluminate to emit light under stress, with optical sensors for detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate detection circuit is installed on the substrate to detect joint part damage, then detection capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the detection function into the existing land structure by embedding stress-sensitive materials (piezoresistive, piezoelectric, or capacitive materials) directly into the land. This integration eliminates the need for separate detection circuits while maintaining detection capability, thereby resolving the contradiction between improved reliability and reduced device complexity.
Solution Approach 2:
The land is designed to serve multiple functions: it provides electrical connection, mechanical support, and damage detection. By incorporating stress-sensitive materials that change electrical characteristics under stress, the land becomes a multi-functional component that detects joint part damage without requiring additional dedicated detection circuitry.
2Measurement precision
If stress-sensitive materials are embedded in the land, then detection precision is improved, but manufacturing complexity increases
Solution Approach 1:
The stress-sensitive materials are incorporated into the land during the manufacturing process itself, rather than being added as a separate post-manufacturing step. The materials are embedded in the land structure before the land is finalized, allowing detection functionality to be built-in during standard manufacturing operations, thereby reducing overall manufacturing complexity despite the added detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables early detection of joint damage by monitoring light emission, allowing for proactive maintenance and reducing the need for additional detection circuits, thus enhancing reliability and reducing costs.
Implementation Method 1
a stress light emitting body that emits light in accordance with stress
Data Source
AI summary
Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.