Substrate Laminate Adhesion via Patterned Photosensitive Film

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Solution Overview

Problem

Existing substrate laminates for image sensors are prone to foreign matter ingress and adhesion issues, leading to position gaps and cracks, which compromises their reliability and adhesiveness.

Innovation Solution

A method for manufacturing a substrate laminate involving a photosensitive composition with a cationically polymerizable group and photocationic polymerization initiator, where the reaction ratio is 90% or more, and an alkaline developer with a low alkali component content, ensuring a high softening point and elastic modulus, and using an epoxy-based adhesive for bonding, resulting in a substrate laminate with enhanced adhesiveness and resistance to foreign matter.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a pattern film is used to bond substrates, then adhesiveness between substrates is improved, but foreign matter may adhere to the pattern film causing position gaps and cracks

Engineering Contradiction:
Improveadhesiveness between substratesVSAvoidforeign matter ingress
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The pattern film is pre-cured before substrate bonding to form a stable, foreign matter-resistant surface. This preliminary curing action creates a robust bonding interface that prevents foreign matter adhesion while maintaining strong substrate adhesion.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention uses a composite structure consisting of a pattern film layer and a filler layer. The filler layer, containing inorganic particles, provides enhanced foreign matter resistance and structural stability, while the pattern film maintains adhesiveness between substrates.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If foreign matter adheres to the pattern film, then position gaps and cracks are generated, but this compromises the reliability of the substrate laminate

Engineering Contradiction:
Improveposition accuracy between substratesVSAvoidsubstrate laminate reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The filler layer acts as an intermediary between the pattern film and the external environment. This intermediate layer prevents foreign matter from directly contacting and damaging the pattern film, thereby maintaining both position accuracy and overall reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The filler layer provides beforehand cushioning protection to the pattern film against foreign matter impact. This protective layer absorbs and distributes mechanical stresses, preventing cracks and position gaps before they can form.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method produces a substrate laminate with improved adhesiveness between substrates and resistance to foreign matter ingress, enhancing the reliability and storage stability of image sensors.

Implementation Method 1

a photosensitive composition containing a curable compound having a cationically polymerizable group and a photocationic polymerization initiator

Methodology Applied
Scientific EffectPhotocationic polymerization: Photopolymerisation

Implementation Method 2

the photosensitive composition has alkali solubility

Methodology Applied
Scientific EffectAlkali solubility: Solvation

Data Source

PatentUS20230408923A1Substrate laminate, image sensor, and method for manufacturing substrate laminate
Publication Date: 2023.12.21 KANEKA CORP
  • US20230408923A1 patent drawing
  • US20230408923A1 patent drawing
  • US20230408923A1 patent drawing

AI summary

A method for manufacturing a substrate laminate includes steps Sa, Sb, Sc, Sd, and Se. In step Sa, a photosensitive composition is applied to one surface of a first substrate to form a coating film on the surface. In step Sb, the coating film is irradiated with an active energy ray through a photomask to form an exposed portion formed of the semi-cured photosensitive composition and a non-exposed portion in the coating film. In step Sc, the non-exposed portion is removed from the first substrate with an alkaline developer to form a patterned coating film on the first substrate. In step Sd, the patterned coating film is heated to obtain a first layer. In step Se, the first layer and a second substrate are bonded to each other with an adhesive interposed therebetween, the adhesive is then cured to obtain a second layer.