Semiconductor Package Substrate Lamination for Fine Wiring Uniformity
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Solution Overview
Problem
The challenge in manufacturing semiconductor packages is forming fine wiring with high density while minimizing variations in wiring width, as existing methods struggle to achieve stable and precise thickness control, leading to issues with warping and reliability.
Innovation Solution
A method involving a laminated body composed of a metal foil, prepregs with an inorganic fiber base material and thermosetting resin composition, where the prepregs are heated to a hot-press temperature with controlled melt viscosity, ensuring a substrate material with reduced thickness variation and improved wiring stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If fine wiring is formed to achieve high density, then wiring density is improved, but wiring width variation increases
Solution Approach 1:
The patent changes the physical-chemical parameters of the prepreg material, specifically controlling the melt viscosity to 5000 Pa·s or less at the lowest point during heating. This parameter change enables the resin to flow and fill mold cavities more uniformly, reducing thickness variation in the substrate and consequently reducing wiring width variation when fine wiring is formed.
2Manufacturing precision
If substrate thickness is reduced to enable fine wiring, then wiring precision is improved, but thickness variation increases
Solution Approach 1:
The patent controls the melt viscosity parameter of the prepreg to 5000 Pa·s or less, which allows the resin to flow more easily and uniformly during hot pressing. This results in better filling of the mold cavity and more uniform substrate thickness, even when the overall thickness is reduced for fine wiring applications.
3Ease of manufacture
If heating temperature is increased to improve resin flow, then resin流动性 is improved, but thickness variation worsens
Solution Approach 1:
Instead of simply increasing heating temperature, the patent changes the viscosity parameter of the resin composition itself by controlling the prepreg formulation. The melt viscosity is maintained at 5000 Pa·s or less through compositional control, which enables good resin flow at moderate temperatures without causing excessive thickness variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the stable formation of fine wiring with reduced width variations, enhancing high-density wiring and reliability, while also improving the mounting of semiconductor chips with fine bumps and reducing warping, thus increasing productivity.
Implementation Method 1
a thermosetting resin composition impregnated in the inorganic fiber base material
Implementation Method 2
a step of increasing a temperature of a laminated body comprising a metal foil, one or more prepregs, and a metal foil, the metal foils and the prepreg are laminated in this order to a hot-press temperature while pressurizing the laminated body
Data Source
AI summary
A method for manufacturing a substrate material for a semiconductor package, including a step of increasing a temperature of a laminated body in which a metal foil, one or more prepregs, and a metal foil are laminated in this order to a hot-press temperature while pressurizing the laminated body. The prepreg contains an inorganic fiber base material and a thermosetting resin composition. A content of the thermosetting resin composition is 40 to 80% by mass on the basis of a mass of the prepreg. In the step of increasing the temperature of the laminated body to the hot-press temperature while pressurizing the laminated body, the laminated body is heated in a condition in which the lowest melt viscosity of the prepreg is 5000 Pa·s or less.