Substrate Laser Machining via T-Junction Etching
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Solution Overview
Problem
Existing laser-machining methods for dividing substrates, such as silicon wafers, face challenges in achieving high precision and efficiency, particularly when dealing with complex shapes like T-shaped portions, and require high-precision equipment to avoid unintended machining, which increases costs and reduces yield.
Innovation Solution
A method that involves etching substrates along predetermined lines, including T-shaped intersections, to set a starting or ending point for laser machining, allowing for precise control and reducing the need for minute laser machining, thereby improving yield and efficiency, and using techniques like pulse oscillation control and phase gratings to enhance precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser-machining is performed on all predetermined dividing lines including T-shaped intersections with high precision, then manufacturing precision is improved, but loss of time increases and productivity decreases
Solution Approach 1:
An etching process is performed in advance on T-shaped intersecting portions of the substrate before laser-machining. This preliminary action creates grooves at critical intersection points, allowing the subsequent laser-machining process to skip these areas and proceed directly to non-intersecting dividing lines, thereby reducing total machining time while maintaining precision
Solution Approach 2:
The substrate dividing process is segmented into two distinct operations: (1) etching process that handles T-shaped intersections and creates preliminary grooves, and (2) laser-machining process that handles only non-intersecting dividing lines. This segmentation allows each process to be optimized independently, improving overall productivity without sacrificing precision
2Manufacturing precision
If high-precision laser-machining apparatus is used to avoid machining T-shaped portions, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The problematic T-shaped intersecting portions are extracted from the laser-machining process entirely. By performing etching on these specific portions beforehand, they are removed from the laser-machining path, allowing the use of simpler, less expensive laser apparatus that do not require complex precision control to avoid these areas
Solution Approach 2:
The etching process acts as an intermediary that prepares the T-shaped intersection areas before laser-machining. This intermediary process creates grooves that prevent the laser from needing to precisely navigate around intersections, thereby simplifying the laser-machining apparatus requirements while maintaining overall precision
3Productivity
If etching is performed on T-shaped intersections before laser-machining, then productivity is improved, but manufacturing complexity increases
Solution Approach 1:
The etching process is integrated into the existing substrate processing workflow, serving multiple functions: (1) creating grooves at T-shaped intersections, (2) preparing surfaces for subsequent laser-machining, and (3) reducing the overall machining time. This multi-functionality justifies the added process step by providing multiple benefits within a single operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the time and cost of machining while maintaining high precision, allowing for efficient division of substrates with improved yield and the ability to control laser irradiation without requiring high-precision equipment, and enables precise formation of grooves for stress application.
Implementation Method 1
a laser-machining method of irradiating a laser beam to machine and divide a substrate in a predetermined shape
Implementation Method 2
expanding stress (for example, tension stress, bending stress, thermal stress, and the like) to break down the substrate
Implementation Method 3
a method of applying heat (energy) to melt a predetermined portion and cutting it
Data Source
AI summary
A method of machining a substrate etches a substrate according to a predetermined length and depth from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate, and divides the substrate along the predetermined dividing lines which are not etched by laser machining.