Substrate Laser Reflection Control for Uniform Etch Heating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate etching processes face challenges in achieving high etching selectivity, uniformity, and etch rate distribution, particularly in high-integration semiconductor devices, where temperature variations affect etching performance.
Innovation Solution
A substrate treating apparatus that includes a laser irradiation unit and a laser reflection unit with tiltable reflection members to control laser distribution and temperature uniformity, enhancing etching performance by adjusting laser tilt angles based on substrate temperature monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser irradiation is applied to heat the substrate, then etching performance is improved, but temperature distribution uniformity deteriorates
Solution Approach 1:
The patent applies local quality by using a tiltable reflection member to redirect laser beams to specific regions of the substrate. The reflection member can be tilted at different angles to concentrate laser irradiation on particular zones, allowing different parts of the substrate to receive differentiated heating treatment based on their specific temperature requirements and etching needs.
Solution Approach 2:
The patent implements dynamics by making the reflection member tiltable and adjustable during the laser irradiation process. The reflection member's angle can be dynamically changed to redirect laser beams to different substrate regions, enabling real-time adjustment of temperature distribution to maintain uniformity while improving etching performance.
2Temperature
If laser irradiation is concentrated on specific zones, then temperature control is improved, but etch rate uniformity deteriorates
Solution Approach 1:
The patent applies periodic action by rotating the substrate during laser irradiation. This rotation ensures that all regions of the substrate sequentially pass through the laser irradiation zone, allowing each region to receive appropriate heating treatment. The periodic rotation maintains temperature control while ensuring uniform etch rate distribution across the entire substrate surface.
Solution Approach 2:
The patent uses dynamics by combining the tiltable reflection member with substrate rotation. The reflection member's angle can be adjusted based on real-time temperature feedback, while the substrate rotates to ensure all regions are treated. This dynamic coordination allows precise temperature control in specific zones while maintaining overall etch rate uniformity through continuous motion and redistribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves uniform etch rate distribution, effective temperature control, and improved etching performance by concentrating laser irradiation on specific substrate zones, addressing temperature-induced etch rate variations.
Implementation Method 1
a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit
Implementation Method 2
a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate
Data Source
AI summary
Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.