Substrate Cut-and-Fracture Layout to Prevent Laser Refraction Damage
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Solution Overview
Problem
The existing methods for cutting substrates using laser light often result in the laser light being refracted into the substrate, causing damage to electronic elements and leading to product defects.
Innovation Solution
The substrate design includes cutting sections and breaking sections that prevent the laser light from being directed towards the edges of the substrate, thereby avoiding refraction and potential damage to electronic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is used to directly cut the substrate from edge to edge, then the corner of the substrate can be cut off, but the laser light is refracted into the substrate and reflected back and forth, causing electronic elements to be burned
Solution Approach 1:
The patent applies preliminary action by designing a cutting path that bypasses the hazardous edge region before laser cutting begins. The cutting entry point is positioned at a first distance from the first edge and the cutting exit point is positioned at a second distance from the second edge, preventing laser light from reaching the edges where refraction and reflection occur. This preliminary path planning eliminates the harmful effect before it can manifest.
Solution Approach 2:
The patent introduces an intermediary approach by using a non-linear cutting path (such as arc-shaped or curved trajectory) between the entry and exit points. This intermediary path keeps the laser beam at a safe distance from the substrate edges throughout the cutting process, avoiding direct interaction with the edge regions that cause refraction and reflection, thereby protecting electronic elements.
2Ease of manufacture
If the laser light is directed towards the edges of the substrate, then the cutting can be completed, but the edge of the substrate refracts the laser light into the inside of the substrate
Solution Approach 1:
The cutting path is pre-designed with entry and exit points positioned at specific distances from the edges, ensuring the laser beam never approaches the hazardous edge regions. This preliminary path configuration maintains manufacturing simplicity while eliminating refraction issues through proper geometric planning.
Solution Approach 2:
The patent changes the parameters of the cutting path by specifying that the entry point is at a first distance from the first edge and the exit point is at a second distance from the second edge. By adjusting these positional parameters and using non-linear path trajectories, the laser cutting process achieves both ease of manufacture and high precision without refraction-induced defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the laser light from being reflected inside the substrate, reducing the risk of electronic element damage and minimizing product defects during the cutting process.
Implementation Method 1
a corner of the substrate is cut using laser light through an outer cutting process
Implementation Method 2
when the laser light cuts to the edge of the substrate, the edge of the substrate will refract the laser light to an inside of the substrate
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
A substrate (1), comprising: at least two edge parts (11, 13); and at least one end part (12), each end part being connected to two adjacent edge parts, wherein each end part comprises a cut section (121) and two fracture sections (122); and one end of the cut section is connected to one of the two adjacent edge parts by means of one fracture section, and the other end of the cut section is connected to the other one of the two adjacent edge parts by means of the other fracture section. The cut section is configured to be formed by cutting by a tool, and the fracture sections are configured to be formed under the action of a physical force. The substrate is conducive to preventing burning of an element, thereby reducing product defects, and improving the universality of a product. Further disclosed are an electronic device, an electronic apparatus, and a method for cutting a substrate.