Insulating Substrate Layout for Cooler Semiconductor Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices with two insulating substrates, excessive heat generation occurs at connection members such as wires connecting the substrates, leading to potential melting and failure.
Innovation Solution
The semiconductor device design includes transistors and diodes on separate insulating substrates, with distinct current paths between them, reducing heat generation at connection members by using different conductive paths for current flow and employing metal plates for enhanced current transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If transistors and diodes are disposed on the same insulating substrate, then the device structure is simplified, but excessive heat generation occurs at connection members connecting insulating substrates
Solution Approach 1:
The patent divides the semiconductor device into multiple insulating substrates, with each substrate carrying specific components (transistors on one substrate, diodes on another). This segmentation separates current paths, preventing excessive heat accumulation at connection members between substrates while maintaining overall structural organization.
2Adaptability or versatility
If connection members connect multiple insulating substrates, then component integration is achieved, but heat generation at connection members causes melting and failure
Solution Approach 1:
By segmenting the device into separate insulating substrates with distinct current paths, the patent reduces current concentration at connection members, thereby reducing heat generation and improving connection reliability while maintaining component integration.
Solution Approach 2:
The patent introduces intermediate connection members (metal plates) with high thermal and electrical conductivity to mediate connections between insulating substrates. These intermediaries efficiently conduct current while dissipating heat, preventing temperature buildup that would cause melting or failure.
3Device complexity
If current flows through the same connection member between substrates, then wiring is simplified, but heat generation becomes excessive
Solution Approach 1:
The patent segments current paths by assigning different current flows to different connection members between substrates. This prevents current concentration in single connection members, reducing heat generation while maintaining manageable wiring complexity through systematic current path distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces heat generation at connection members, preventing overheating and melting, while facilitating easier connection and improved current flow, thus enhancing the reliability and efficiency of the semiconductor device.
Implementation Method 1
a first diode having a first anode electrode and a first cathode electrode, the first diode being connected in parallel to the first transistor
Implementation Method 2
paths of the currents flowing between the first insulating substrate and the second insulating substrate can be different
Implementation Method 3
a heat dissipation plate having a first main surface and a second main surface opposite to the first main surface, the first insulating substrate and the second insulating substrate are mounted on the first main surface
Data Source
AI summary
A semiconductor device includes a first insulating substrate, a second insulating substrate, a first transistor provided on the first insulating substrate, and a first diode provided on the second insulating substrate and connected in parallel to the first transistor.