Semiconductor Package Substrate Layout for Low-Loss Multi-Directional Antennas
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Solution Overview
Problem
The integration of multiple directional antennas in wireless communication devices to enhance millimeter wave signal propagation leads to increased cost and size, and existing solutions with multiple antenna modules suffer from high path loss and latency due to complex substrate structures.
Innovation Solution
A semiconductor device package with a flexible substrate and electronic component configuration, where antennas are disposed on multiple surfaces of the substrate, allowing for multi-directional radiation without the need for multiple modules, utilizing a build-up process to reduce substrate layers and enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple directional antennas are configured to radiate in various directions, then signal gain and bandwidth are improved, but device size and cost increase
Solution Approach 1:
The patent merges multiple antenna functions into a single substrate by disposing multiple antennas (first antenna, second antenna, third antenna, fourth antenna) on different surfaces and regions of one integrated substrate structure. This consolidation achieves multi-directional radiation capability without requiring separate antenna modules, thereby improving signal gain while avoiding the size and cost penalties of multiple discrete components.
Solution Approach 2:
The patent utilizes three-dimensional space by disposing antennas on multiple surfaces (front surface, back surface, side surfaces) of the substrate rather than limiting antennas to a single plane. This spatial arrangement enables multi-directional radiation patterns while maintaining a compact form factor, as the antennas leverage the vertical and lateral dimensions of the substrate to achieve diverse radiation directions without increasing overall device footprint.
2Productivity
If multiple antenna modules are equipped to achieve higher bandwidth, then data transmission rate is improved, but device cost and size increase
Solution Approach 1:
The patent combines multiple antenna elements and their supporting structures into a single integrated substrate assembly. The substrate includes multiple antennas with different orientations (first antenna along first direction, second antenna along second direction, etc.) that can be manufactured together as one unit, eliminating the need for multiple separate antenna modules and reducing overall system complexity and cost while maintaining high bandwidth capability.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the structural support, the signal transmission medium, and the mounting platform for multiple antennas with different radiation patterns. This multi-functional design allows the single substrate to replace what would traditionally require multiple specialized components, thereby reducing device complexity and cost while achieving high data transmission rates through multi-directional antenna arrays.
3Adaptability or versatility
If complex substrate structures are used with multiple antenna modules, then multi-directional radiation is achieved, but signal loss and latency increase
Solution Approach 1:
The patent segments the antenna array into multiple independently oriented elements (first antenna, second antenna, third antenna, fourth antenna) disposed at different locations and orientations on the substrate. Each antenna segment can be optimized for specific radiation directions while sharing the same low-loss substrate material, achieving multi-directional radiation capability without the signal loss penalties of complex interconnected module structures.
Solution Approach 2:
The patent changes the material parameter of the substrate by specifying low dielectric constant and low loss tangent materials. This parameter optimization reduces signal attenuation and phase loss as signals travel between antennas and the electronic component, thereby minimizing signal loss and latency while maintaining the multi-directional radiation capability provided by the antenna geometry and arrangement.
Data Source
AI summary
A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.