Substrate LED Phosphor Assembly for Precise Color and Brightness
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Solution Overview
Problem
Current LED technologies face challenges in reducing production costs while maintaining brightness and efficiency, with a need for improved manufacturability and customization to meet various lighting applications.
Innovation Solution
The development of substrate-based LEDs with electrically conductive traces, reflective materials, and phosphor or color conversion components, which enhance processing efficiency, reduce costs, and improve optical properties such as consistent color targeting and reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional LED manufacturing methods are used, then production cost is reduced, but manufacturing precision and optical properties deteriorate
Solution Approach 1:
The LED device is divided into distinct functional layers including a substrate, reflective material layer, phosphor layer, and LED chip layer. Each layer is manufactured and optimized independently, allowing for precise control of optical properties while maintaining manufacturing efficiency through modular assembly processes.
Solution Approach 2:
The patent employs composite material structures combining substrate materials, reflective materials (such as metal or dielectric layers), phosphor materials, and encapsulant materials. These composite structures enable simultaneous optimization of optical performance, thermal management, and manufacturing characteristics.
2Ease of manufacture
If fewer raw materials are used, then production cost is reduced, but brightness and performance deteriorate
Solution Approach 1:
The patent optimizes the thickness, composition, and optical properties of each material layer to achieve maximum brightness efficiency. By carefully controlling parameters such as reflective layer thickness, phosphor concentration, and encapsulant refractive index, the design achieves high brightness output with minimized material usage and cost.
Solution Approach 2:
The design incorporates feedback mechanisms through optimized optical pathways and reflective structures that maximize light extraction efficiency. The reflective material layer redirects photons that would otherwise be lost, effectively amplifying the brightness output from the same LED chip input, thereby reducing the need for additional high-cost materials.
3Productivity
If processing time is reduced, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent employs preliminary preparation of pre-cut substrate wafers with pre-applied reflective material layers and pre-dispersed phosphor materials. These pre-prepared components are designed for rapid assembly, enabling high-volume production while maintaining consistent color targeting through pre-calibrated material compositions and layer thicknesses.
Solution Approach 2:
The manufacturing process utilizes optimized curing parameters, sintering temperatures, and bonding conditions that enable rapid processing without compromising precision. By carefully controlling time-temperature profiles and material properties, the patent achieves both fast processing speeds and precise color reproduction in the final LED product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in LEDs that are more efficient, brighter, and cost-effective, with improved manufacturability and customization options for diverse lighting applications, including personal, industrial, and commercial use.
Implementation Method 1
a reflective material and/or a phosphor or other color conversion component
Implementation Method 2
a reflective material and/or a phosphor or other color conversion component
Data Source
AI summary
Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.